參數資料
型號： MPC8548EPXATGB
廠商： Freescale Semiconductor
文件頁數： 40/151頁
文件大?。?/td> 0K
描述： MPU POWERQUICC III 783-PBGA
產品培訓模塊： MPC8548 PowerQUICC III Processors
標準包裝： 1
系列： MPC85xx
處理器類型： 32-位 MPC85xx PowerQUICC III
速度： 1.2GHz
電壓： 1.1V
安裝類型： 表面貼裝
封裝/外殼： 783-BBGA，FCBGA
供應商設備封裝： 783-FCPBGA（29x29）
包裝： 托盤
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
134
Freescale Semiconductor
Thermal
21 Thermal
This section describes the thermal specifications of the device.
21.1
Thermal for Version 2.0 Silicon HiCTE FC-CBGA with Full Lid
This section describes the thermal specifications for the HiCTE FC-CBGA package for revision 2.0
silicon.
This table shows the package thermal characteristics.
21.2
Thermal for Version 2.1.1, 2.1.2, and 2.1.3 Silicon FC-PBGA with
Full Lid and Version 3.1.x Silicon with Stamped Lid
This section describes the thermal specifications for the FC-PBGA package for revision 2.1.1, 2.1.2, and
3.0 silicon.
This table shows the package thermal characteristics.
Table 84. Package Thermal Characteristics for HiCTE FC-CBGA
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Die junction-to-ambient (natural convection)
Single-layer board (1s)
RJA
17
°C/W
1, 2
Die junction-to-ambient (natural convection)
Four-layer board (2s2p)
RJA
12
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Single-layer board (1s)
RJA
11
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Four-layer board (2s2p)
RJA
8°C/W
1, 2
Die junction-to-board
N/A
RJB
3°C/W3
Die junction-to-case
N/A
RJC
0.8
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the
interface layer.
Table 85. Package Thermal Characteristics for FC-PBGA
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Die junction-to-ambient (natural convection)
Single-layer board (1s)
RJA
18
°C/W
1, 2
Die junction-to-ambient (natural convection)
Four-layer board (2s2p)
RJA
13
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Single-layer board (1s)
RJA
13
°C/W
1, 2
Die junction-to-ambient (200 ft/min)
Four-layer board (2s2p)
RJA
9°C/W
1, 2
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MPC8548EPXAUJA 制造商:Freescale Semiconductor 功能描述:MPC85XX RISC 32-BIT CMOS 1.333GHZ 1.8V/2.5V/3.3V 783-PIN BGA - Bulk
MPC8548EPXAUJB 功能描述:微處理器 - MPU FG PQ38 8548 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8548EPXAUJC 功能描述:微處理器 - MPU REV2.1.3 FG part 1333 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8548EPXAUJD 功能描述:微處理器 - MPU PQ38 PB ST WE 1333 R3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8548EPXAVHA 制造商:Freescale Semiconductor 功能描述:MPC85XX RISC 32-BIT CMOS 1.5GHZ 1.8V/2.5V/3.3V 783-PIN BGA T - Bulk
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