參數(shù)資料
型號(hào): MPC8555ECPXALEX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù): 53/88頁
文件大小: 1244K
代理商: MPC8555ECPXALEX
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
57
Package and Pin Listings
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
5. Capacitors may not be present on all devices.
6. Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.
7. The socket lid must always be oriented to A1.
14.3
Pinout Listings
Table 44 provides the pin-out listing for the MPC8555E, 783 FC-PBGA package.
Table 43. MPC8555E Pinout Listing
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PCI1 and PCI2 (one 64-bit or two 32-bit)
PCI1_AD[63:32],
PCI2_AD[31:0]
AA14, AB14, AC14, AD14, AE14, AF14, AG14, AH14,
V15, W15, Y15, AA15, AB15, AC15, AD15, AG15,
AH15, V16, W16, AB16, AC16, AD16, AE16, AF16,
V17, W17, Y17, AA17, AB17, AE17, AF17, AF18
I/O
OVDD
17
PCI1_AD[31:0]
AH6, AD7, AE7, AH7, AB8, AC8, AF8, AG8, AD9,
AE9, AF9, AG9, AH9, W10, Y10, AA10, AE11, AF11,
AG11, AH11, V12, W12, Y12, AB12, AD12, AE12,
AG12, AH12, V13, Y13, AB13, AC13
I/O
OVDD
17
PCI_C_BE64[7:4]
PCI2_C_BE[3:0]
AG13, AH13, V14, W14
I/O
OVDD
17
PCI_C_BE64[3:0]
PCI1_C_BE[3:0]
AH8, AB10, AD11, AC12
I/O
OVDD
17
PCI1_PAR
AA11
I/O
OVDD
PCI1_PAR64/PCI2_PAR
Y14
I/O
OVDD
PCI1_FRAME
AC10
I/O
OVDD
2
PCI1_TRDY
AG10
I/O
OVDD
2
PCI1_IRDY
AD10
I/O
OVDD
2
PCI1_STOP
V11
I/O
OVDD
2
PCI1_DEVSEL
AH10
I/O
OVDD
2
PCI1_IDSEL
AA9
I
OVDD
PCI1_REQ64/PCI2_FRAME
AE13
I/O
OVDD
5, 10
PCI1_ACK64/PCI2_DEVSEL AD13
I/O
OVDD
2
PCI1_PERR
W11
I/O
OVDD
2
PCI1_SERR
Y11
I/O
OVDD
2, 4
PCI1_REQ[0]
AF5
I/O
OVDD
PCI1_REQ[1:4]
AF3, AE4, AG4, AE5
I
OVDD
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