參數(shù)資料
型號(hào)： MPC8560CPX667JD
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, PLASTIC, FCBGA-783
文件頁(yè)數(shù)： 91/104頁(yè)
文件大?。?/td> 1244K
代理商： MPC8560CPX667JD
MPC8560 Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
87
Thermal
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
16.2.4
Heat Sink Selection Examples
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
16.2.4.1
Case 1
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
TJ = TI + TR + (θJC + θINT + θSA) × PD
where
TJ is the die-junction temperature
TI is the inlet cabinet ambient temperature
TR is the air temperature rise within the computer cabinet
θ
JC is the junction-to-case thermal resistance
θINT is the adhesive or interface material thermal resistance
θSA is the heat sink base-to-ambient thermal resistance
PD is the power dissipated by the device
During operation the die-junction temperatures (TJ) should be maintained within the range specified in
Table 2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (TA)
may range from 30
° to 40°C. The air temperature rise within a cabinet (T
R) may be in the range of 5° to
10
°C. The thermal resistance of some thermal interface material (θ
INT) may be about 1°C/W. Assuming a
TI of 30 C, a TR of 5 C, a FC-PBGA package θJC = 0.8, and a power consumption (PD) of 7.0 W, the
following expression for TJ is obtained:
Die-junction temperature: TJ = 30°C + 5°C + (0.8°C/W + 1.0°C/W + θSA) × 7.0 W
The heat sink-to-ambient thermal resistance (
θ
SA) versus airflow velocity for a Thermalloy heat sink
#2328B is shown in Figure 55.
Assuming an air velocity of 2 m/s, we have an effective
θ
SA+ of about 3.3
C/W, thus
TJ = 30 C + 5 C + (0.8 C/W +1.0 C/W + 3.3 C/W) × 7.0 W,
resulting in a die-junction temperature of approximately 71 C which is well within the maximum
operating temperature of the component.
相關(guān)PDF資料
PDF描述
MPC8560CPX667LC 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
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MPC8560VT667LC 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8560CPX833LB 32-BIT, 883 MHz, RISC PROCESSOR, PBGA783
MPC8560PX667LB 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8560CPX667LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560CVT667JB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560CVT667JC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560CVT667LB 功能描述:微處理器 - MPU PQ 3 8560 Dracom RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560PX667LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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