參數(shù)資料
型號(hào): MPC8560CVT833LC
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 883 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù): 7/108頁
文件大?。?/td> 1238K
代理商: MPC8560CVT833LC
MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
104
Freescale Semiconductor
Device Nomenclature
19 Device Nomenclature
Ordering information for the parts fully covered by this specification document is provided in
19.1 Part Numbers Fully Addressed by this Document
Table 63 provides the Freescale part numbering nomenclature for the MPC8560. Note that the individual
part numbers correspond to a maximum processor core frequency. For available frequencies, contact your
local Freescale sales office. In addition to the processor frequency, the part numbering scheme also
includes an application modifier which may specify special application conditions. Each part number also
contains a revision code which refers to the die mask revision number.
Table 63. Part Numbering Nomenclature
MPC
nnnn
t
pp
ff(f)
c
r
Product
Code
Part
Identifier
Temperature
Range 1
Package 2
Processor
Frequency 3, 4
Platform
Frequency
Revision Level
MPC
8560
Blank = 0 to 105
°C
C= -40 to 105
°C
PX = FC-PBGA
VT = FC-PBGA
(Pb-free)
833 = 833 MHz
667 = 667 MHz
L = 333 MHz
J= 266 MHz
B = Rev. 2.0
(SVR = 0x80700020)
C = Rev. 2.1
(SVR = 0x80700021)
MPC
8560
Blank = 0 to 105
°C
C = –40 to 105
°C
PX = FC-PBGA
VT = FC-PBGA
(Pb-free)
AQ = 1.0 GHz
F = 333 MHz
B = Rev. 2.0
(SVR = 0x80700020)
C = Rev. 2.1
(SVR = 0x80700021)
Notes:
1.For Temperature Range=C, Processor Frequency is limited to 667 MHz.
2.See Section 14, “Package and Pin Listings” for more information on available package types.
3.Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. The core must be clocked at a minimum frequency of 400 MHz. A device
must not be used beyond the core frequency or platform frequency indicated on the device.
4. Designers should use the maximum power value corresponding to the core and platform frequency grades indicated on
the device. A lower maximum power value should not be assumed for design purposes even when running at a lower
frequency.
相關(guān)PDF資料
PDF描述
MPC8560VT667LC 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8560CPX833LB 32-BIT, 883 MHz, RISC PROCESSOR, PBGA783
MPC8560PX667LB 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8560VT667LB 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8560CVT833JB 32-BIT, 883 MHz, RISC PROCESSOR, PBGA783
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8560PX667LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560PX667LC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560PX833LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560PX833LC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560PXAQFB 功能描述:微處理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324