參數(shù)資料
            

            


            


            
型號(hào)：
MPC8560PX667LB

            

            
廠商：
FREESCALE SEMICONDUCTOR INC

            

            
元件分類(lèi)：
微控制器/微處理器

            

            
英文描述：
32-BIT, 667 MHz, RISC PROCESSOR, PBGA783

            

            
封裝：
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783

            

            
文件頁(yè)數(shù)：
94/108頁(yè)

            

            
文件大小：
1238K

            

            
代理商：
MPC8560PX667LB


            

            

            

	
            
    
    

    
            
	
            MPC8560 Integrated Processor Hardware Specifications, Rev. 4.2
            86
            Freescale Semiconductor
            Thermal
            Figure 53 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
            printed-circuit board.
            Figure 53. Package with Heat Sink Mounted to a Printed-Circuit Board
            The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is
            conducted through the silicon and through the lid, then through the heat sink attach material (or thermal
            interface material), and finally to the heat sink. The junction-to-case thermal resistance is low enough that
            the heat sink attach material and heat sink thermal resistance are the dominant terms.
            16.2.3 Thermal Interface Materials
            A thermal interface material is required at the package-to-heat sink interface to minimize the thermal
            contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
            Figure 54 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
            graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
            As shown, the performance of these thermal interface materials improves with increasing contact pressure.
            The use of thermal grease significantly reduces the interface thermal resistance. The bare joint results in a
            thermal resistance approximately six times greater than the thermal grease joint.
            Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
            Figure 51). Therefore, the synthetic grease offers the best thermal performance, especially at the low
            interface pressure.
            When removing the heat sink for re-work, it is preferable to slide the heat sink off slowly until the thermal
            interface material loses its grip. If the support fixture around the package prevents sliding off the heat sink,
            the heat sink should be slowly removed. Heating the heat sink to 40-50°C with an air gun can soften the
            interface material and make the removal easier. The use of an adhesive for heat sink attach is not
            recommended.
            External Resistance
            Internal Resistance
            Radiation
            Convection
            Radiation
            Convection
            Heat Sink
            Printed-Circuit Board
            Thermal Interface Material
            Package/Leads
            Die Junction
            Die/Package
            (Note the internal versus external package resistance)
            
    
            
    
    
            


            


            

            相關(guān)PDF資料
            		

            PDF描述
            		

            
            

            
MPC8560VT667LB
32-BIT, 667 MHz, RISC PROCESSOR, PBGA783

            

            
MPC8560CVT833JB
32-BIT, 883 MHz, RISC PROCESSOR, PBGA783

            

            
MPC8560CPX833JC
32-BIT, 883 MHz, RISC PROCESSOR, PBGA783

            

            
MPC8560CPX833LC
32-BIT, 883 MHz, RISC PROCESSOR, PBGA783

            

            
MPC8560PX833FB
32-BIT, 883 MHz, RISC PROCESSOR, PBGA783

            

            

            

            


            


            

            相關(guān)代理商/技術(shù)參數(shù)
            		

            參數(shù)描述
            		

            
            

            
MPC8560PX667LC
功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

            

            
MPC8560PX833LB
功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

            

            
MPC8560PX833LC
功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

            

            
MPC8560PXAQFB
功能描述:微處理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

            

            
MPC8560PXAQFC
功能描述:微處理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324

            

            
    
    
    
	
            	
    
    
     
     
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