參數(shù)資料
型號: MPC8560PX833FB
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 883 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù): 99/108頁
文件大小: 1379K
代理商: MPC8560PX833FB
MPC8560 Integrated Processor Hardware Specifications, Rev. 4
90
Freescale Semiconductor
Thermal
The spring mounting should be designed to apply the force only directly above the die. By localizing the
force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to
the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the
opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the
package. Figure 55 and Figure 56 provide exploded views of the plastic fence, heat sink, and spring clip.
Figure 55. Exploded Views (1) of a Heat Sink Attachment using a Plastic Force
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