參數(shù)資料
型號: MPC8567EVTANGG
廠商: Freescale Semiconductor
文件頁數(shù): 67/139頁
文件大小: 0K
描述: MPU POWERQUICC III 1023-PBGA
標準包裝: 24
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 800MHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 1023-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 1023-FCPBGA(33x33)
包裝: 托盤
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
33
Ethernet Interface and MII Management
8.2.3.1
MII Transmit AC Timing Specifications
Table 29 provides the MII transmit AC timing specifications.
Figure 12 shows the MII transmit AC timing diagram.
Figure 12. MII Transmit AC Timing Diagram
8.2.3.2
MII Receive AC Timing Specifications
Table 30 provides the MII receive AC timing specifications.
Table 29. MII Transmit AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX
2
400
ns
TX_CLK clock period 100 Mbps
tMTX
—40
ns
TX_CLK duty cycle
tMTXH/tMTX
35
65
%
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
tMTKHDX
1
5
15
ns
TX_CLK data clock rise (20%-80%)
tMTXR
2
1.0
4.0
ns
TX_CLK data clock fall (80%-20%)
tMTXF
2
1.0
4.0
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII
transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in
general, the clock reference symbol representation is based on two to three letters representing the clock of a particular
functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
Table 30. MII Receive AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period 10 Mbps
tMRX
2
—400
ns
RX_CLK clock period 100 Mbps
tMRX
—40
ns
RX_CLK duty cycle
tMRXH/tMRX
35
65
%
TX_CLK
TXD[3:0]
tMTKHDX
tMTX
tMTXH
tMTXR
tMTXF
TX_EN
TX_ER
相關(guān)PDF資料
PDF描述
ACB106DHAN-S621 EDGECARD 212POS DIP R/A .050 SLD
ACB106DHAD-S621 EDGECARD 212POS DIP R/A .050 SLD
AMC49DRAI CONN EDGECARD 98POS .100 R/A DIP
FMC28DREN CONN EDGECARD 56POS .100 EYELET
XC4044XL-1HQ304C IC FPGA C-TEMP 3.3V 1SPD 304HQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8567EVTAQGG 功能描述:微處理器 - MPU No PB 1.0 GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8567EVTAUJJ 功能描述:微處理器 - MPU No PB 1.3 GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8567VTANGG 功能描述:微處理器 - MPU 800MHz Non-Encrypt RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8567VTAQGG 功能描述:微處理器 - MPU 1GHz Non-Encrypt RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8567VTAUJJ 功能描述:微處理器 - MPU Non-Encrypt No PB 1.3GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324