參數(shù)資料
型號(hào): MPC8569VTAQLJA
廠商: FREESCALE SEMICONDUCTOR INC
元件分類(lèi): 微控制器/微處理器
英文描述: RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783
文件頁(yè)數(shù): 117/126頁(yè)
文件大?。?/td> 2847K
代理商: MPC8569VTAQLJA
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MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 0
Serial RapidIO (SRIO)
Freescale Semiconductor
90
(RD and RD). Each signal swings between A volts and B volts where A > B. Using these waveforms, the definitions are as
follows:
1.
The transmitter output signals and the receiver input signals TD, TD, RD, and RD each have a peak-to-peak swing of
A – B volts
2.
The differential output signal of the transmitter, VOD, is defined as VTD – VTD
3.
The differential input signal of the receiver, VID, is defined as VRD – VRD
4.
The differential output signal of the transmitter and the differential input signal of the receiver each range from A – B
to –(A – B) volts
5.
The peak value of the differential transmitter output signal and the differential receiver input signal is A – B volts
6.
The peak-to-peak value of the differential transmitter output signal and the differential receiver input signal is 2
× (A
– B) volts
Figure 47. Differential Peak-Peak Voltage of Transmitter or Receiver
To illustrate these definitions using real values, consider the case of a CML (current mode logic) transmitter that has a common
mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing that goes between 2.5 and 2.0 V. Using these values,
the peak-to-peak voltage swing of the signals TD and TD is 500 mV p-p. The differential output signal ranges between 500 and
–500 mV. The peak differential voltage is 500 mV. The peak-to-peak differential voltage is 1000 mV p-p.
2.11.2
Equalization
With the use of high speed serial links, the interconnect media will cause degradation of the signal at the receiver. Effects such
as inter-symbol interference (ISI) or data dependent jitter are produced. This loss can be large enough to degrade the eye opening
at the receiver beyond what is allowed in the specification. To negate a portion of these effects, equalization can be used. The
most common equalization techniques that can be used are:
Pre-emphasis on the transmitter
A passive high pass filter network placed at the receiver. This is often referred to as passive equalization.
The use of active circuits in the receiver. This is often referred to as adaptive equalization.
Differential Peak-to-Peak = 2
× (A – B)
A Volts
TD or RD
B Volts
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8569VTAQLJB 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 8569 ST 1067/667/533 r2.1 RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
MPC8569VTAUNLB 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 8569 ST 1333/667/533 r2.1 RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
MPC8572CLVTAULD 功能描述:微處理器 - MPU 1333 LOW PWR EXT TEMP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572CLVTAULE 功能描述:微處理器 - MPU R211 NoE NoPb 1333LP Ext RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572CLVTAVND 功能描述:微處理器 - MPU 1500 ExtTmp LwPwr RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324