參數(shù)資料
型號(hào): MPC8572EVTAVNE
廠商: Freescale Semiconductor
文件頁數(shù): 3/138頁
文件大?。?/td> 0K
描述: MPU POWERQUICC III 1023FCPBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.5GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 1023-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 1023-FCPBGA(33x33)
包裝: 托盤
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
100
Freescale Semiconductor
Package Description
18.2
Mechanical Dimensions of the MPC8572E FC-PBGA
Figure 61 shows the mechanical dimensions of the MPC8572E FC-PBGA package with full lid.
Figure 61. Mechanical Dimensions of the MPC8572E FC-PBGA with Full Lid
NOTES:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. All dimensions are symmetric across the package center lines unless dimensioned otherwise.
4. Maximum solder ball diameter measured parallel to datum A.
5. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
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