參數(shù)資料
型號: MPC859DSL
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Hardware Specifications
中文描述: 硬件規(guī)格
文件頁數(shù): 11/92頁
文件大?。?/td> 1274K
代理商: MPC859DSL
MOTOROLA
MPC866/859 Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
11
Thermal Calculation and Measurement
7
Thermal Calculation and Measurement
For the following discussions, P
D
= (VDDL x IDDL) + PI/O, where PI/O is the power dissipation of the I/O
drivers. The VDDSYN power dissipation is negligible.
Input low voltage
VIL
GND
0.8
V
EXTAL, EXTCLK input high voltage
VIHC
0.7*(VDDH)
VDDH
V
Input leakage current, Vin = 5.5V (except TMS, TRST,
DSCK and DSDI pins) for 5 Volts Tolerant Pins
2
I
in
100
μA
Input leakage current, Vin = VDDH (except TMS, TRST,
DSCK, and DSDI)
I
In
10
μA
Input leakage current, Vin = 0 V (except TMS, TRST,
DSCK and DSDI pins)
I
In
10
μA
Input capacitance
3
C
in
20
pF
Output high voltage, IOH = – 2.0 mA,
except XTAL, and Open drain pins
VOH
2.4
V
Output low voltage
IOL = 2.0 mA (CLKOUT)
IOL = 3.2 mA
4
IOL = 5.3 mA
5
IOL = 7.0 mA (TXD1/PA14, TXD2/PA12)
IOL = 8.9 mA (TS, TA, TEA, BI, BB, HRESET, SRESET)
VOL
0.5
V
1
The difference between VDDL and VDDSYN can not be more than 100 m V.
2
The signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], TDI, TDO, TCK, TRST_B, TMS, MII_TXEN, MII_MDIO are 5 V
tolerant.
3
Input capacitance is periodically sampled.
4
A(0:31), TSIZ0/REG, TSIZ1, D(0:31), DP(0:3)/IRQ(3:6), RD/WR, BURST, RSV/IRQ2, IP_B(0:1)/IWP(0:1)/VFLS(0:1),
IP_B2/IOIS16_B/AT2, IP_B3/IWP2/VF2, IP_B4/LWP0/VF0, IP_B5/LWP1/VF1, IP_B6/DSDI/AT0, IP_B7/PTR/AT3,
RXD1 /PA15, RXD2/PA13, L1TXDB/PA11, L1RXDB/PA10, L1TXDA/PA9, L1RXDA/PA8,
TIN1/L1RCLKA/BRGO1/CLK1/PA7, BRGCLK1/TOUT1/CLK2/PA6, TIN2/L1TCLKA/BRGO2/CLK3/PA5,
TOUT2/CLK4/PA4, TIN3/BRGO3/CLK5/PA3, BRGCLK2/L1RCLKB/TOUT3/CLK6/PA2, TIN4/BRGO4/CLK7/PA1,
L1TCLKB/TOUT4/CLK8/PA0, REJCT1/SPISEL/PB31, SPICLK/PB30, SPIMOSI/PB29, BRGO4/SPIMISO/PB28,
BRGO1/I2CSDA/PB27, BRGO2/I2CSCL/PB26, SMTXD1/PB25, SMRXD1/PB24, SMSYN1/SDACK1/PB23,
SMSYN2/SDACK2/PB22, SMTXD2/L1CLKOB/PB21, SMRXD2/L1CLKOA/PB20, L1ST1/RTS1/PB19,
L1ST2/RTS2/PB18, L1ST3/L1RQB/PB17, L1ST4/L1RQA/PB16, BRGO3/PB15, RSTRT1/PB14,
L1ST1/RTS1/DREQ0/PC15, L1ST2/RTS2/DREQ1/PC14, L1ST3/L1RQB/PC13, L1ST4/L1RQA/PC12, CTS1/PC11,
TGATE1/CD1/PC10, CTS2/PC9, TGATE2/CD2/PC8, CTS3/SDACK2/L1TSYNCB/PC7, CD3/L1RSYNCB/PC6,
CTS4/SDACK1/L1TSYNCA/PC5, CD4/L1RSYNCA/PC4, PD15/L1TSYNCA, PD14/L1RSYNCA, PD13/L1TSYNCB,
PD12/L1RSYNCB, PD11/RXD3, PD10/TXD3, PD9/RXD4, PD8/TXD4, PD5/REJECT2, PD6/RTS4, PD7/RTS3,
PD4/REJECT3, PD3, MII_MDC, MII_TX_ER, MII_EN, MII_MDIO, MII_TXD[0:3].
5
BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:5), CS(6)/CE(1)_B, CS(7)/CE(2)_B, WE0/BS_B0/IORD,
WE1/BS_B1/IOWR, WE2/BS_B2/PCOE, WE3/BS_B3/PCWE, BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A,
ALE_B/DSCK/AT1, OP(0:1), OP2/MODCK1/STS, OP3/MODCK2/DSDO, BADDR(28:30).
Table 6. DC Electrical Specifications (continued)
Characteristic
Symbol
Min
Max
Unit
F
Freescale Semiconductor, Inc.
n
.
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