參數(shù)資料
型號(hào): MPX2100AP
廠商: Motorola, Inc.
元件分類: 壓力傳感器
英文描述: 0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
中文描述: 0至100千帕(0到14.5 PSI)的全尺寸為40 mV跨度(典型)
文件頁(yè)數(shù): 3/10頁(yè)
文件大?。?/td> 194K
代理商: MPX2100AP
3
Motorola Sensor Device Data
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
Figure 2. Linearity Specification Comparison
LEAST
SQUARE
DEVIATION
R
PRESSURE (% FULLSCALE)
0
50
100
END POINT
STRAIGHT LINE FIT
EXAGGERATED
PERFORMANCE
CURVE
LEAST SQUARES FIT
STRAIGHT LINE
DEVIATION
OFFSET
ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the MPX2100
series at 25
°
C. The output is directly proportional to the
differential pressure and is essentially a straight line.
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteris-
tics.
Figure 3. Output versus Pressure Differential
Figure 4. Cross–Sectional Diagrams (Not to Scale)
O
kPa
PSI
40
35
30
25
20
15
10
5
0
–50
25
3.62
50
7.25
75
10.87
100
14.5
SPAN
RANGE
(TYP)
OFFSET
(TYP)
TYP
MIN
VS = 10 Vdc
TA = 25
°
C
P1 > P2
MAX
ééééééééééé
ééééééééééé
DIFFERENTIAL/GAUGE ELEMENT
SILICONE GEL
DIE COAT
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE
DIE
P1
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIE
BOND
ééééééééééé
ééééééééééé
ééééééééééé
ééééééééééé
ABSOLUTE ELEMENT
P2
SILICONE GEL
DIE COAT
WIRE BOND
LEAD FRAME
ABSOLUTE
DIE
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIE
BOND
P2
P1
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344–15). A silicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon
diaphragm.
The MPX2100 series pressure sensor operating charac-
teristics and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor perfor-
mance and long term reliability. Contact the factory for in-
formation regarding media compatibility in your application.
相關(guān)PDF資料
PDF描述
MPX2100ASX 0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
MPX2100D 0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
MPX2100DP 0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
MPX2100GP 0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
MPX2100GSX 0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPX2100AP 制造商:Freescale Semiconductor 功能描述:Pressure Sensor IC Package/Case:4-334B
MPX2100AP 制造商:Freescale Semiconductor 功能描述:Pressure Sensors IC
MPX2100AS 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
MPX2100ASX 功能描述:板上安裝壓力/力傳感器 PRES SEN COMP 100KPA RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides
MPX2100ASX 制造商:Freescale Semiconductor 功能描述:Pressure Sensor IC Package/Case:CASE 344