1
Motorola, Inc. 1999
"
# " !
Motorola has developed a low cost, high volume, miniature pressure sensor package
which is ideal as a sub–module component or a disposable unit. The unique concept of
the Chip Pak allows great flexibility in system design while allowing an economic solution
for the designer. This new chip carrier package uses Motorola’s unique sensor die with its
piezoresistive technology, along with the added feature of on–chip, thin–film temperature
compensation and calibration.
Features:
Low Cost
Patented piezoresistive strain gauge implant, temperature compensation and
calibration all integrated on a single, monolithic sensor die.
Pressure Range Available: 0–10 kPa
Polysulfone (Mindel S–1000) Case Material (Medical, Class VI Approved)
Application Examples
Respiratory Diagnostics
Air Movement Control
Controllers
Pressure Switching
Motorola is offering the Chip Pak option package. Application–specific parts will have
an “SPX” prefix, followed by a four digit number, unique to the specific customer. Devices
will be shipped in a tape and reel packaging.
NOTE:
The die and wire bonds are exposed on the front side of the Chip Pak. Front
side die and wire protection must be provided in the customer’s housing. Use caution
when handling the devices during all processes. P1 is defined as the pressure applies to
front side (wirebond side) of the Chip Pak and P2 is defined as the pressure applied to
the backside (portal side).
Motorola’s MPXC2011DT1 Pressure Sensors.
Motoro-
la’s MPXC2011DT1 pressure sensor has been designed for
medical usage by combining the performance of Motorola’s
shear stress pressure sensor design and the use of
biomedically approved materials. Materials with a proven
history in medical situations have been chosen to provide a
sensor that can be used with confidence in applications,
such as invasive blood pressure monitoring. It can be
sterilized using ethylene oxide. The portions of the pressure
sensor that are required to be biomedically approved are the
rigid housing and the gel coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: tissue culture test, rabbit implant, hemolysis,
intracutaneous test in rabbits, and system toxicity, USP.
A silicone dielectric gel that has been used extensively in
implants covers the silicon piezoresistive sensing element.
The gel is a nontoxic, nonallergenic polymer system which
passes pyrogen testing, as well as meeting all USP XX Bio-
logical Testing Class VI requirements. The properties of the
gel allow it to transmit pressure uniformly to the diaphragm
surface, while isolating the internal electrical connections
from the corrosive effects of fluids, such as saline solution.
The gel provides electrical isolation sufficient to withstand
defibrillation testing, as specified in the proposed Association
for the Advancement of Medical Instrumentation (AAMI)
Standard for blood pressure transducers. A biomedically ap-
proved opaque filler in the gel prevents bright operating room
lights from affecting the performance of the sensor.
X–ducer is a trademark of Motorola, Inc.
Order this document
by MPXC2011DT1/D
SEMICONDUCTOR TECHNICAL DATA
PRESSURE SENSORS
PIN NUMBER
CHIP PAK ELEMENT
CASE 423A–03
1
2
Gnd
S+
3
4
VS
S–
REV 0