參數資料
型號: MPXL5010
廠商: Motorola, Inc.
英文描述: OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR
中文描述: 經營概況集成壓力傳感器
文件頁數: 3/8頁
文件大?。?/td> 136K
代理商: MPXL5010
3
Motorola Sensor Device Data
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 illustrates the Differential/Gauge Sensing Chip in
the basic Low Profile Package (Case 469). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the sen-
sor diaphragm.
The MPXL5010 series pressure sensor operating charac-
teristics, and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long–term reliability. Contact the factory for information
regarding media compatibility in your application.
Figure 3 shows a typical decoupling circuit for interfacing
the integrated sensor to the A/D input of a microprocessor.
Proper decoupling of the power supply is recommended.
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0
°
to
85
°
C using the decoupling circuit below. (The output will sat-
urate outside of the specified pressure range.)
Figure 2. Cross–Sectional Diagram
(Not to Scale)
μ
PROCESSOR
A/D
51 k
50 pF
MPXL5010
OUTPUT
(PIN 4)
Figure 3. Typical Decoupling Filter for Sensor to
Microprocessor Interface
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FLUORO SILICONE
WIRE BONDS
LEAD FRAME
DIE
STAINLESS STEEL
METAL COVER
P1
Figure 4. Output versus Pressure Differential
DIFFERENTIAL PRESSURE (kPa)
5.0
4.0
3.0
2.0
0
11
7
3
0
O
9
5
4.5
3.5
2.5
1.5
1
1.0
0.5
10
6
2
8
4
TRANSFER FUNCTION:
Vout = VS*(0.09*P+0.04)
±
ERROR
VS = 5.0 Vdc
TEMP = 0 to 85
°
C
TYPICAL
MAX
MIN
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