參數(shù)資料
型號: MSM64152A-XXX
廠商: LAPIS SEMICONDUCTOR CO LTD
元件分類: 微控制器/微處理器
英文描述: 4-BIT, MROM, 0.075 MHz, MICROCONTROLLER, UUC57
封裝: 3.90 X 3.48 MM, DIE-57
文件頁數(shù): 19/26頁
文件大小: 172K
代理商: MSM64152A-XXX
25/25
Semiconductor
MSM64152A/64152AL
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
QFP60-P-1519-1.00-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.50 TYP.
Mirror finish
相關PDF資料
PDF描述
MSM64152A-XXXGS-K 4-BIT, MROM, 0.075 MHz, MICROCONTROLLER, PQFP60
MSM64152AL-XXXGS-K 4-BIT, MROM, 0.075 MHz, MICROCONTROLLER, PQFP60
MSM64155A-XXX 4-BIT, MROM, 0.075 MHz, MICROCONTROLLER, UUC99
MSM64158A-XXX 4-BIT, MROM, 0.075 MHz, MICROCONTROLLER, UUC64
MSM64158A-XXXGS-BK 4-BIT, MROM, 0.075 MHz, MICROCONTROLLER, PQFP64
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