參數(shù)資料
型號(hào): MSM65522-XXXRS
廠商: LAPIS SEMICONDUCTOR CO LTD
元件分類: 微控制器/微處理器
英文描述: 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PDIP42
封裝: 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42
文件頁(yè)數(shù): 13/23頁(yè)
文件大?。?/td> 212K
代理商: MSM65522-XXXRS
19/22
Semiconductor
MSM65522/65P522
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SDIP42-P-600-1.78
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
4.52 TYP.
相關(guān)PDF資料
PDF描述
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