參數(shù)資料
型號: MSM7577
廠商: OKI SEMICONDUCTOR CO., LTD.
英文描述: Voice Signal Level Control LSI
中文描述: 語音信號電平控制大規(guī)模集成電路
文件頁數(shù): 8/8頁
文件大?。?/td> 73K
代理商: MSM7577
MSM7577
Semiconductor
8/8
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SOP16-P-300-1.27-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
Cu alloy
Solder plating
5
m
m or more
0.21 TYP.
Mirror finish
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