參數(shù)資料
型號： MSP430F4260IRGZR
廠商： TEXAS INSTRUMENTS INC
元件分類： 微控制器/微處理器
英文描述： 16-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PQCC48
封裝： GREEN, PLASTIC, QFN-48
文件頁數(shù)： 52/63頁
文件大?。?/td> 1342K
代理商： MSP430F4260IRGZR
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
MSP430F4250IDL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F4250IDLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F4250IRGZR
ACTIVE
VQFN
RGZ
48
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430F4250IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430F4260IDL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F4260IDLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F4260IRGZR
ACTIVE
VQFN
RGZ
48
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430F4260IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430F4270IDL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F4270IDLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F4270IRGZR
ACTIVE
VQFN
RGZ
48
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
MSP430F4270IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2009
Addendum-Page 1
相關PDF資料
PDF描述
MSP430F4260IRGZT 16-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PQCC48
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相關代理商/技術參數(shù)
參數(shù)描述
MSP430F4260IRGZT 功能描述:16位微控制器 - MCU 16-bit Ultra-Lo-Pwr RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風格:SMD/SMT
MSP430F4270IDL 功能描述:16位微控制器 - MCU 16-bit Ultra-Lo-Pwr RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風格:SMD/SMT
MSP430F4270IDL 制造商:Texas Instruments 功能描述:16-BIT MICROCONTROLLER IC
MSP430F4270IDLR 功能描述:16位微控制器 - MCU 16-bit Ultra-Lo-Pwr RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風格:SMD/SMT
MSP430F4270IRGZR 功能描述:16位微控制器 - MCU 16-bit Ultra-Lo-Pwr RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風格:SMD/SMT
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