參數(shù)資料
型號(hào)： MSP430F5632IPZ
廠商： TEXAS INSTRUMENTS INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 16-BIT, FLASH, 20 MHz, RISC MICROCONTROLLER, PQFP100
封裝： GREEN, PLASTIC, LQFP-100
文件頁(yè)數(shù)： 43/101頁(yè)
文件大?。?/td> 1073K
代理商： MSP430F5632IPZ
PRODUCTPREVIEW
MSP430F563x
SLAS650A – JUNE 2010 – REVISED JULY 2010
www.ti.com
Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(1) (2)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
fOSC = 4 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 0,
200
TA = 25°C
fOSC = 12 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 1,
260
TA = 25°C
XT2 oscillator crystal current
IDVCC,XT2
3 V
A
consumption
fOSC = 20 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 2,
325
TA = 25°C
fOSC = 32 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 3,
450
TA = 25°C
XT2 oscillator crystal frequency,
fXT2,HF0
XT2DRIVEx = 0, XT2BYPASS = 0(3)
4
8
MHz
mode 0
XT2 oscillator crystal frequency,
fXT2,HF1
XT2DRIVEx = 1, XT2BYPASS = 0(3)
8
16
MHz
mode 1
XT2 oscillator crystal frequency,
fXT2,HF2
XT2DRIVEx = 2, XT2BYPASS = 0(3)
16
24
MHz
mode 2
XT2 oscillator crystal frequency,
fXT2,HF3
XT2DRIVEx = 3, XT2BYPASS = 0(3)
24
32
MHz
mode 3
XT2 oscillator logic-level
fXT2,HF,SW
XT2BYPASS = 1(4) (3)
1.5
32
MHz
square-wave input frequency
XT2DRIVEx = 0, XT2BYPASS = 0,
450
fXT2,HF0 = 6 MHz, CL,eff = 15 pF
XT2DRIVEx = 1, XT2BYPASS = 0,
320
fXT2,HF1 = 12 MHz, CL,eff = 15 pF
Oscillation allowance for
OAHF
HF crystals(5)
XT2DRIVEx = 2, XT2BYPASS = 0,
200
fXT2,HF2 = 20 MHz, CL,eff = 15 pF
XT2DRIVEx = 3, XT2BYPASS = 0,
200
fXT2,HF3 = 32 MHz, CL,eff = 15 pF
fOSC = 6 MHz
XT2BYPASS = 0, XT2DRIVEx = 0,
0.5
TA = 25°C,
CL,eff = 15 pF
tSTART,HF
Startup time
3 V
ms
fOSC = 20 MHz
XT2BYPASS = 0, XT2DRIVEx = 3,
0.3
TA = 25°C,
CL,eff = 15 pF
Integrated effective load
CL,eff
1
pF
capacitance, HF mode(6) (1)
Measured at ACLK, fXT2,HF2 =
Duty cycle
40
50
60
%
20 MHz
(1)
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(2)
To improve EMI on the XT2 oscillator the following guidelines should be observed.
(a) Keep the traces between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
(d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(3)
Maximum frequency of operation of the entire device cannot be exceeded.
(4)
When XT2BYPASS is set, the XT2 circuit is automatically powered down.
(5)
Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(6)
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
46
Copyright 2010, Texas Instruments Incorporated
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