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參數(shù)資料
| 型號(hào)： | MSW2051-205-T |
| 元件分類： | PIN二極管 |
| 英文描述： | SILICON, PIN DIODE |
| 封裝： | 8 X 5 MM, 2.50 MM HEIGHT, ROHS COMPLIANT, CASE 205, 4 PIN |
| 文件頁數(shù)： | 5/12頁 |
| 文件大?。?/td> | 532K |
| 代理商： | MSW2051-205-T |
TEL: 603-641-SEMI (7364) metelics-sales@aeroflex.com www.aeroflex.com/metelics
Revision Date: 4/20/10
2
Parameter
Symbol
Units
Test Conditions
Minimum
Typical
Maximum
Value
Frequency
F
MHz
20
50 – 1000
1500
Tx-Ant Insertion Loss
IL(Tx)
dB
0 V @ 100 mA (Tx )
| -0.15 |
| -0.25 |
28V @ 25 mA (Rx)
Ant-Rx Insertion Loss
IL(Rx)
dB
0V@ 100 mA (Rx )
| -0.25 |
| -0.35 |
28V @ 0 mA (Tx)
Tx-Ant Return Loss
RL(Tx)
dB
0 V @ 100 mA (Tx )
| -20 |
| -23 |
28V @ 25 mA (Rx)
Ant-Rx Return Loss
RL(Rx)
dB
0 V @ 100 mA (Rx )
| -20 |
| -22 |
28V @ 0 mA (Tx)
Tx-Rx Isolation
Isol(Rx)
dB
0 V @ 100 mA (Tx )
| -47 |
| -50 |
28V @ 25 mA (Rx)
Rx-Tx Isolation
Isol(Tx)
dB
0 V @ 100 mA (Rx )
| -25 |
| -28 |
28V @ 25 mA (Tx)
C.W. Incident Power
Pinc(CW)
dBm
0 V @ 100 mA (Tx )
+52
IL(Tx)
28V @ 25 mA (Rx)
1.5:1 Source & Load VSWR
C.W. Incident Power
Pinc(CW)
dBm
0V @ 100 mA (Rx )
+43
+44
IL(Rx)
28V @ 0mA(Tx)
1.5:1 Source & Load VSWR
Peak. Incident Power
Pinc(Pk)
dBm
0 V @ 100 mA (Tx )
+58 @
IL(Tx)
28V @ 25 mA (Rx)
10 μS Pulse,
1.5:1 Source & Load VSWR
1 % Duty
Switching Speed
Ts
μS
(10% -90% RF Voltage)
2
3
Input 3rd Order
IIP3
dBm
F1 = 500 MHz
60
65
Intercept Point
F2 = 510 MHz
P1 = P2 = +40 dBm
MSW2050-205 Electrical Specifications
@ Zo = 50
Ω, TA=+ 25C (UnlessOtherwiseDefined)
Electrical Specification Notes:
1.
Switching Speed ( 50 % TTL – 10/90 % RF Voltage ) is a Function of the PIN Diode Driver Performance.
A RC “ Current Spiking Network” is used on the Driver output to provide a Ic = C dV/dt transient current
to move Stored charge through the PIN Diode, typical values are: R = 50 – 220
Ω and C = 470– 1,000pF.
2.
For Hot Switching, PIN Diode Driver must Transition from Forward Bias to Reverse Bias and Reverse
Bias to Forward Bias within 100
ηS with a parallel RC spiking network at the Driver Output.
3.
Backside RF and D.C. Grounding Area of Device must be Completely Solder Attached to RF Circuit
Board Vias for Proper Electrical and Thermal RF Circuit Grounding.
SP2T PIN Diode Switches
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