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    參數(shù)資料
    型號(hào): MT46V4M16
    廠商: Micron Technology, Inc.
    英文描述: 1 Meg x 16 x 4 banks DDR SDRAM(1M x 16 x 4組,雙數(shù)據(jù)速率同步動(dòng)態(tài)RAM)
    中文描述: 1梅格× 16 × 4銀行DDR SDRAM內(nèi)存(100萬× 16 × 4組,雙數(shù)據(jù)速率同步動(dòng)態(tài)RAM)的
    文件頁數(shù): 7/69頁
    文件大小: 2369K
    代理商: MT46V4M16
    7
    64Mb: x4, x8, x16 DDR SDRAM
    64Mx4x8x16DDR_B.p65
    Rev. B; Pub. 10/00
    Micron Technology, Inc., reserves the right to change products or specifications without notice.
    2000, Micron Technology, Inc.
    64Mb: x4, x8, x16
    DDR SDRAM
    PIN DESCRIPTIONS
    TSOP PIN NUMBERS
    45, 46
    SYMBOL
    CK, CK#
    TYPE
    Input
    DESCRIPTION
    Clock: CK and CK# are differential clock inputs. All address and
    control input signals are sampled on the crossing of the positive edge
    of CK and negative edge of CK#. Output data (DQs and DQS) is
    referenced to the crossings of CK and CK#.
    Clock Enable: CKE HIGH activates and CKE LOW deactivates the
    internal clock, input buffers and output drivers. Taking CKE LOW
    provides PRECHARGE POWER-DOWN and SELF REFRESH operations
    (all banks idle), or ACTIVE POWER-DOWN (row ACTIVE in any bank).
    CKE is synchronous for POWER-DOWN entry and exit, and for SELF
    REFRESH entry. CKE is asynchronous for SELF REFRESH exit and for
    disabling the outputs. CKE must be maintained HIGH throughout
    read and write accesses. Input buffers (excluding CK, CK# and CKE)
    are disabled during POWER-DOWN. Input buffers (excluding CKE)
    are disabled during SELF REFRESH. CKE is an SSTL_2 input but will
    detect an LVCMOS LOW level after V
    DD
    is applied.
    Chip Select: CS# enables (registered LOW) and disables (registered
    HIGH) the command decoder. All commands are masked when CS# is
    registered HIGH. CS# provides for external bank selection on systems
    with multiple banks. CS# is considered part of the command code.
    Command Inputs: RAS#, CAS#, and WE# (along with CS#) define the
    command being entered.
    Input Data Mask: DM is an input mask signal for write data. Input
    data is masked when DM is sampled HIGH along with that input data
    during a WRITE access. DM is sampled on both edges of DQS.
    Although DM pins are input-only, the DM loading is designed to
    match that of DQ and DQS pins. For the x16 , LDM is DM for DQ0-
    DQ7 and UDM is DM for DQ8-DQ15. Pin 20 is a NC on x4 and x8
    Bank Address Inputs: BA0 and BA1 define to which bank an ACTIVE,
    READ, WRITE, or PRECHARGE command is being applied.
    Address Inputs: Provide the row address for ACTIVE commands, and
    the column address and auto precharge bit (A10) for READ/WRITE
    commands, to select one location out of the memory array in the
    respective bank. A10 sampled during a PRECHARGE command
    determines whether the PRECHARGE applies to one bank (A10 LOW,
    bank selected by BA0, BA1) or all banks (A10 HIGH). The address
    inputs also provide the op-code during a MODE REGISTER SET
    command. BA0 and BA1 define which mode register (mode register
    or extended mode register) is loaded during the LOAD MODE
    REGISTER command.
    Data Input/Output: Data bus for x16 (4, 7, 10, 13, 54, 57, 60, and 63
    are NC for x8), (2, 4, 7, 8,10, 13, 54, 57, 59, 60, 63, and 65 for x4).
    Data Input/Output: Data bus for x8 (2, 8, 59, and 65 are NC for x4).
    Data Input/Output: Data bus for x4.
    44
    CKE
    Input
    24
    CS#
    Input
    23, 22, 21
    RAS#, CAS#,
    WE#
    DM
    LDM, UDM
    Input
    47
    Input
    20, 47
    26, 27
    BA0, BA1
    Input
    29-32, 35-40,
    28, 41
    A0
    A11
    Input
    2, 4, 5, 7, 8, 10, 11, 13, 54,
    56, 57, 59, 60, 62, 63, 65
    2, 5, 8, 11, 56, 59, 62, 65
    5, 11, 56, 62
    DQ0
    15
    I/O
    DQ0
    7
    DQ0
    3
    I/O
    I/O
    (continued on next page)
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