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參數(shù)資料
| 型號(hào)： | MTB10N40ET4 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | JFETs |
| 英文描述： | 10 A, 400 V, 0.55 ohm, N-CHANNEL, Si, POWER, MOSFET |
| 封裝： | CASE 418B-02, D2PAK-3 |
| 文件頁數(shù)： | 2/11頁 |
| 文件大小： | 276K |
| 代理商： | MTB10N40ET4 |
MTB10N40E
http://onsemi.com
10
RECOMMENDED PROFILE FOR REFLOW SOLDERING
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 18 shows a typical heating profile for use when
soldering the D2PAK to a printed circuit board. This profile will
vary among soldering systems but it is a good starting point.
Factors that can affect the profile include the type of soldering
system in use, density and types of components on the
board, type of solder used, and the type of board or substrate
material being used. This profile shows temperature versus
time. The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or near
a central solder joint. The two profiles are based on a high
density and a low density board. The Vitronics SMD310
convection/infrared reflow soldering system was used to
generate this profile. The type of solder used was 62/36/2 Tin
Lead Silver with a melting point between 177189°C. When
this type of furnace is used for solder reflow work, the circuit
boards and solder joints tend to heat first. The components
on the board are then heated by conduction. The circuit
board, because it has a large surface area, absorbs the
thermal energy more efficiently, then distributes this energy
to the components. Because of this effect, the main body of
a component may be up to 30 degrees cooler than the
adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
HEATING
ZONES 3 & 6
SOAK"
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
STEP 6
VENT
STEP 7
COOLING
200
°C
150
°C
100
°C
50
°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205
° TO 219°C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
100
°C
150
°C
160
°C
170
°C
140
°C
Figure 18. Typical Solder Heating Profile for D2PAK
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