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參數(shù)資料
| 型號： | MZ5010G |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 中文描述： | 集成硅壓力傳感器的片上信號空調(diào)，溫度補償和校準(zhǔn) |
| 文件頁數(shù)： | 6/14頁 |
| 文件大?。?/td> | 382K |
| 代理商： | MZ5010G |
MPVZ5010G
Sensors
6
Freescale Semiconductor
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media. The MPX pressure sensor
is designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. SOP Footprint (Case 482)
Part Number
Case Type
Pressure (P1)
Side Identifier
MPVZ5010GW6U
1735-01
Vertical Port Attached
MPVZ5010GW7U
1560-02
Vertical Port Attached
MPVZ5010G6U/T1
482-01
Stainless Steel Cap
MPVZ5010G7U
482B-03
Stainless Steel Cap
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1
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相關(guān)代理商/技術(shù)參數(shù) |
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| MZ5010GW | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
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