參數(shù)資料
型號(hào): NB3F8L3010CMNR4G
廠商: ON Semiconductor
文件頁(yè)數(shù): 5/13頁(yè)
文件大?。?/td> 0K
描述: IC FANOUT BUFFER 3:10 32QFN
標(biāo)準(zhǔn)包裝: 1,000
類(lèi)型: 扇出緩沖器(分配),多路復(fù)用器
電路數(shù): 1
比率 - 輸入:輸出: 3:10
差分 - 輸入:輸出: 是/無(wú)
輸入: HCSL, LVDS, LVPECL, SSTL, 晶體
輸出: LVCMOS,LVTTL
頻率 - 最大: 200MHz
電源電壓: 2.375 V ~ 3.465 V
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 32-QFN(5x5)
包裝: 帶卷 (TR)
NB3F8L3010C
http://onsemi.com
13
PACKAGE DIMENSIONS
QFN32 5x5, 0.5P
CASE 488AM
ISSUE A
SEATING
NOTE 4
K
0.15
C
(A3)
A
A1
D2
b
1
9
17
32
E2
32X
8
L
32X
BOTTOM VIEW
TOP VIEW
SIDE VIEW
D
A
B
E
0.15
C
PIN ONE
LOCATION
0.10
C
0.08
C
C
25
e
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PLANE
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50
3.35
0.30
3.35
32X
0.63
32X
5.30
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTION
DETAIL B
DETAIL A
DIM
A
MIN
MILLIMETERS
0.80
A1
A3
0.20 REF
b
0.18
D
5.00 BSC
D2
2.95
E
5.00 BSC
2.95
E2
e
0.50 BSC
0.30
L
K
0.20
1.00
0.05
0.30
3.25
0.50
MAX
L1
0.15
e/2
NOTE 3
PITCH
DIMENSION: MILLIMETERS
RECOMMENDED
A
M
0.10
B
C
M
0.05
C
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
NB3F8L3010C/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
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Sales Representative
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