參數(shù)資料
型號(hào): NB4L52MNR2G
廠商: ON Semiconductor
文件頁數(shù): 3/8頁
文件大?。?/td> 0K
描述: IC FLIP FLOP DATA/CLK DFF 16-QFN
標(biāo)準(zhǔn)包裝: 3,000
功能: 復(fù)位
類型: D 型
輸出類型: 差分
元件數(shù): 1
每個(gè)元件的位元數(shù): 1
延遲時(shí)間 - 傳輸: 400ps
觸發(fā)器類型: 負(fù)邊沿
電源電壓: 2.3 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VFQFN 裸露焊盤
包裝: 帶卷 (TR)
NB4L52
http://onsemi.com
3
Table 3. ATTRIBUTES
Characteristic
Value
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 200 V
> 1 kV
Moisture Sensitivity (Note 2)
Pb Pkg
PbFree Pkg
QFN16
Level 1
Flammability Rating Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
Transistor Count
164
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
2. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Positive Power Supply
VEE = 0 V
6.0
V
VEE
Negative Power Supply
VCC = 0 V
6.0
V
VIO
Positive Input/Output
Negative Input/Output
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
6.0
V
IIN
Input Current Through RT (50 W Resistor)
Static
Surge
45
80
mA
Iout
Output Current
Continuous
Surge
25
50
mA
TA
Operating Temperature Range
40 to +85
°C
Tstg
Storage Temperature Range
65 to +150
°C
qJA
Thermal Resistance (JunctiontoAmbient)
0 LFPM
500 LFPM
16 QFN
42
35
°C/W
qJC
Thermal Resistance (JunctiontoCase)
2S2P (Note 3)
16 QFN
4.0
°C/W
Tsol
Wave Solder
PbFree
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. JEDEC standard multilayer board 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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