參數(shù)資料
型號: NB4L6254FAR2G
廠商: ON Semiconductor
文件頁數(shù): 6/11頁
文件大?。?/td> 0K
描述: IC CLK MUX SWITCH 1:6/1:3 32LQFP
標準包裝: 2,000
類型: 多路復用器,開關
電路數(shù): 1 或 2
比率 - 輸入:輸出: 1:6,1:3
差分 - 輸入:輸出: 是/是
輸入: LVCMOS,LVPECL
輸出: LVPECL
頻率 - 最大: 3GHz
電源電壓: 2.375 V ~ 3.465 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-LQFP
供應商設備封裝: 32-LQFP(7x7)
包裝: 帶卷 (TR)
NB4L6254
http://onsemi.com
4
Table 4. ATTRIBUTES
Characteristics
Value
Internal Input Pullup Resistor
37.5 kW
Internal Input Pulldown Resistor
75 kW
ESD Protection
Human Body Model
Machine Model
> 2000 V
> 200 V
Latchup Immunity
>200 mA
Cin, inputs
4.0 pF (TYP)
Moisture Sensitivity (Note 1)
LQFP32
QFN32
Level 2
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
Transistor Count
336
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 5. MAXIMUM RATINGS (Note 2)
Symbol
Parameter
Condition
Rating
Unit
VCC
Positive Power Supply
0.3 v VCC v 3.6
V
VIN
DC Input Voltage
0.3 v VIN v VCC
+ 0.3
V
VOUT
DC Output Voltage
0.3 v VOUT v VCC
+ 0.3
V
IIN
DC Input Current
$20
mA
Iout
LVPECL DC Output Current
Continuous
Surge
$50
100
mA
TA
Operating Temperature Range
LQFP32
40 to +85
°C
Tstg
Storage Temperature Range
65 to +150
°C
qJA
Thermal Resistance (JunctiontoAmbient)
(Note 3)
0 lfpm
500 lfpm
LQFP32
80
55
°C/W
qJC
Thermal Resistance (JunctiontoCase)
2S2P (Note 3)
LQFP32
12 to 17
°C/W
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
QFN32
31
27
°C/W
qJC
Thermal Resistance (JunctiontoCase)
2S2P
QFN32
12
°C/W
Tsol
Wave Solder
PbFree
265
°C
VTT
Output Termination Voltage
VCC – 2.0, TYP
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. Maximum Ratings are those values beyond which device damage may occur.
3. JEDEC standard multilayer board 2S2P (2 signal, 2 power); MILSPEC 883E Method 1012.1.
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