參數(shù)資料
型號: NB7L14MNTXG
廠商: ON Semiconductor
文件頁數(shù): 10/10頁
文件大?。?/td> 0K
描述: IC CLOCK BUFFER 1:4 8GHZ 16-QFN
標準包裝: 3,000
系列: GigaComm™
類型: 扇出緩沖器(分配)
電路數(shù): 1
比率 - 輸入:輸出: 1:4
差分 - 輸入:輸出: 是/是
輸入: CML,LVCMOS,LVDS,LVPECL,LVTTL
輸出: LVPECL
頻率 - 最大: 8GHz
電源電壓: 2.375 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VFQFN 裸露焊盤
供應商設備封裝: 16-QFN(3x3)
包裝: 帶卷 (TR)
NB7L14
http://onsemi.com
9
PACKAGE DIMENSIONS
QFN16 3x3, 0.5P
CASE 485G01
ISSUE E
16X
SEATING
PLANE
L
D
E
0.10 C
A
A1
e
D2
E2
b
1
4
8
9
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
B
A
0.10 C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
LOCATION
0.05 C
(A3)
C
NOTE 4
16X
0.10 C
0.05 C
A B
NOTE 3
K
16X
DIM MIN
MAX
MILLIMETERS
A
0.80
1.00
A1
0.00
0.05
A3
0.20 REF
b
0.18
0.30
D
3.00 BSC
D2
1.65
1.85
E
3.00 BSC
E2
1.65
1.85
e
0.50 BSC
K
L
0.30
0.50
0.18 TYP
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL A
DETAIL B
L1
0.00
0.15
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
2X
0.50
PITCH
1.84 3.30
1
DIMENSIONS: MILLIMETERS
0.58
16X
2X
0.30
16X
OUTLINE
PACKAGE
2X
0.10 C A B
e/2
SOLDERING FOOTPRINT*
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