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| 型號： | NCC5003MW |
| 廠商： | California Micro Devices Corporation |
| 英文描述： | BUSSED RESISTOR NETWORK |
| 中文描述： | 一天夜里，電阻網(wǎng)絡(luò) |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 63K |
| 代理商： | NCC5003MW |
2000 California Micro Devices Corp. All rights reserved.
6/2/2000
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
1
CALIFORNIA MICRO DEVICES
NCC
BUSSED RESISTOR NETWORK
California Micro Devices’ resistor arrays are the hybrid
equivalent to the bussed resistor networks available in
surface-mount packages. The resistors are spaced on
ten mil centers resulting in reduced real estate. These
C0970500
STANDARD NETWORK SCHEMATIC DIAGRAM
chips are manufactured using advanced thin film
processing techniques and are 100% electrically
tested and visually inspected.
R1
R4
R2
R5
R7
R3
R6
R8
60
90
N
O
I
T
A
N
G
I
S
E
D
R
E
B
M
A
U
N
T
R
A
P
C
C
N
3
0
0
5
F
G
W
P
s
e
e
S
e
u
V
e
c
n
a
r
e
T
R
C
T
s
d
a
P
d
n
o
B
g
n
c
a
B
o
R
a
r
e
T
r
L
5
=
e
1
c
n
=
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v
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r
b
m
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c
n
R
.
o
z
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m
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e
d
s
t
a
t
s
e
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3
t
g
a
L
%
5
±
1
±
2
±
5
±
1
±
2
±
=
=
=
=
=
=
D
F
G
J
K
M
m
p
p
0
0
1
±
=
m
p
p
0
5
±
p
5
2
±
r
L
=
=
o
N
A
B
d
G
r
L
=
G
N
d
G
p
a
L
r
L
=
W
L
N
%
o
N
P
.
-
f
e
c
t
%
%
%
0
0
m
u
n
m
u
=
o
d
h
=
e
p
=
o
%
m
p
r
s
%
%
.
p
S
C
N
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t
e
T
I
A
C
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P
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L
A
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s
N
C
T
C
C
o
D
T
S
A
C
°
0
5
1
-
M
6
0
1
2
D
T
S
-
M
M
8
0
3
d
o
h
M
≥
-
M
@
°
°
5
5
2
2
1
1
y
e
-
M
o
o
n
7
0
1
@
C
C
°
°
5
5
5
5
–
–
e
D
(
d
o
h
M
H
0
0
1
o
h
M
8
0
1
C
/
m
c
d
w
m
0
5
%
5
2
±
2
±
5
±
5
±
3
–
3
–
2
x
1
p
p
V
0
0
0
5
1
±
x
x
x
x
x
x
x
x
x
x
a
a
a
a
a
a
a
a
a
a
.
M
M
M
M
M
M
M
M
M
M
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e
p
k
c
n
R
l
m
)
C
°
0
5
1
F
@
0
t
2
0
°
5
2
0
2
D
T
S
-
k
0
5
2
0
4
3
8
R
C
°
5
2
0
C
°
0
7
@
2
2
e
m
2
D
T
S
1
F
2
0
@
%
5
%
%
d
5
d
0
%
5
0
1
R
R
R
R
B
B
e
s
o
p
x
E
s
d
F
C
F
)
0
0
0
1
d
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h
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e
2
d
e
c
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O
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e
R
e
m
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t
h
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o
s
n
1
n
2
1
S
N
O
c
,
)
n
c
0
0
0
1
o
o
d
g
e
d
N
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T
s
A
m
c
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o
C
2
I
F
0
0
d
g
m
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n
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u
0
0
0
1
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c
I
C
n
o
0
1
2
d
e
p
p
a
L
E
P
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L
A
C
I
N
A
H
C
E
M
e
b
u
S
o
s
n
c
a
B
z
M
k
n
±
0
1
c
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r
y
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n
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,
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n
n
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S
E
0
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L
m
A
V
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s
e
8
K
0
0
5
o
G
m
N
s
I
G
p
c
A
6
K
9
C
A
f
P
s
.
d
n
a
s
m
u
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1
y
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q
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p
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e
R
.
Formats
Die Size: 90±3 x 60±3 mils
Bonding Pads: 5x7 mils typical
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