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參數(shù)資料
| 型號： | NCN5192MNRG |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 5/13頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC HART MODEM CMOS SGL 32QFN |
| 標準包裝： | 1 |
| 系列： | * |
NCN5192
http://onsemi.com
13
PACKAGE DIMENSIONS
QFN32 5*5*1 0.5 P
CASE 488AM01
ISSUE O
SEATING
32 X
K
0.15
C
(A3)
A
A1
D2
b
1
9
16
17
32
2 X
E2
32 X
8
24
32 X
L
32 X
BOTTOM VIEW
EXPOSED PAD
TOP VIEW
SIDE VIEW
D
A
B
E
0.15
C
PIN ONE
LOCATION
0.10
C
0.08
C
C
25
e
A
0.10
B
C
0.05 C
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PLANE
DIM MIN
NOM
MAX
MILLIMETERS
A
0.800 0.900 1.000
A1
0.000 0.025 0.050
A3
0.200 REF
b
0.180 0.250 0.300
D
5.00 BSC
D2
2.950 3.100 3.250
E
5.00 BSC
E2
e
0.500 BSC
K
0.200
L
0.300 0.400 0.500
2.950 3.100 3.250
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50 PITCH
3.20
0.28
3.20
32 X
28 X
0.63
32 X
5.30
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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NCN5192/D
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