參數(shù)資料
型號(hào): NCS2001SQ2T2G
廠商: ON Semiconductor
文件頁(yè)數(shù): 7/16頁(yè)
文件大小: 0K
描述: IC OPAMP R-R 0.9V 1MHZ SOT-353
標(biāo)準(zhǔn)包裝: 1
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1.6 V/µs
增益帶寬積: 1.4MHz
電流 - 輸入偏壓: 10pA
電壓 - 輸入偏移: 500µV
電流 - 電源: 820µA
電流 - 輸出 / 通道: 96mA
電壓 - 電源,單路/雙路(±): 0.9 V ~ 7 V,±0.45 V ~ 3.5 V
工作溫度: -40°C ~ 105°C
安裝類型: 表面貼裝
封裝/外殼: 6-TSSOP(5 引線),SC-88A,SOT-353
供應(yīng)商設(shè)備封裝: SC-70-5
包裝: 剪切帶 (CT)
其它名稱: NCS2001SQ2T2GOSCT
NCS2001, NCV2001
http://onsemi.com
15
PACKAGE DIMENSIONS
TSOP5
CASE 48302
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM
MIN
MAX
MILLIMETERS
A
3.00 BSC
B
1.50 BSC
C
0.90
1.10
D
0.25
0.50
G
0.95 BSC
H
0.01
0.10
J
0.10
0.26
K
0.20
0.60
M
0
10
S
2.50
3.00
12
3
54
S
A
G
B
D
H
C
J
__
0.7
0.028
1.0
0.039
mm
inches
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
C AB
T
0.10
2X
T
0.20
NOTE 5
C SEATING
PLANE
0.05
K
M
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
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