
LM317, NCV317
http://onsemi.com
2
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
InputOutput Voltage Differential
V
I
V
O
40
Vdc
Power Dissipation
Case 221A
T
A
= +25
°
C
Thermal Resistance, JunctiontoAmbient
Thermal Resistance, JunctiontoCase
Case 936 (D
2
PAK3)
T
A
= +25
°
C
Thermal Resistance, JunctiontoAmbient
Thermal Resistance, JunctiontoCase
Operating Junction Temperature Range
P
D
JA
JC
Internally Limited
65
5.0
W
°
C/W
°
C/W
P
D
JA
JC
T
J
T
stg
Internally Limited
70
5.0
55 to +150
W
°
C/W
°
C/W
°
C
°
C
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
65 to +150
ELECTRICAL CHARACTERISTICS
(V
I
V
O
= 5.0 V; I
O
= 0.5 A for D2T and T packages; T
J
= T
low
to T
high
(Note 1); I
max
and P
max
(Note 2); unless otherwise noted.)
Characteristics
Figure
Symbol
Min
Typ
Max
Unit
Line Regulation (Note 3), T
A
= +25
°
C, 3.0 V
≤
V
I
V
O
≤
40 V
Load Regulation (Note 3), T
A
= +25
°
C, 10 mA
≤
I
O
≤
I
max
V
O
≤
5.0 V
V
O
≥
5.0 V
Thermal Regulation, T
A
= +25
°
C (Note 4), 20 ms Pulse
Adjustment Pin Current
1
Reg
line
Reg
load
0.01
0.04
%/V
2
5.0
0.1
25
0.5
mV
% V
O
% V
O
/W
A
Reg
therm
I
Adj
I
Adj
0.03
0.07
3
50
100
Adjustment Pin Current Change, 2.5 V
≤
V
I
V
O
≤
40 V,
10 mA
≤
I
L
≤
I
max
, P
D
≤
P
max
Reference Voltage, 3.0 V
≤
V
I
V
O
≤
40 V,
10 mA
≤
I
O
≤
I
max
, P
D
≤
P
max
Line Regulation (Note 3), 3.0 V
≤
V
I
V
O
≤
40 V
Load Regulation (Note 3), 10 mA
≤
I
O
≤
I
max
V
O
≤
5.0 V
V
O
≥
5.0 V
Temperature Stability (T
low
≤
T
J
≤
T
high
)
Minimum Load Current to Maintain Regulation (V
I
V
O
= 40 V)
Maximum Output Current
V
I
V
O
≤
15 V, P
D
≤
P
max,
T Package
V
I
V
O
= 40 V, P
D
≤
P
max
, T
A
= +25
°
C, T Package
RMS Noise, % of V
O
, T
A
= +25
°
C, 10 Hz
≤
f
≤
10 kHz
Ripple Rejection, V
O
= 10 V, f = 120 Hz (Note 5)
Without C
Adj
C
Adj
= 10 F
LongTerm Stability, T
J
= T
high
(Note 6), T
A
= +25
°
C for
Endpoint Measurements
1, 2
0.2
5.0
A
3
V
ref
1.2
1.25
1.3
V
1
Reg
line
Reg
load
0.02
0.07
% V
2
20
0.3
70
1.5
mV
% V
O
% V
O
mA
3
T
S
I
Lmin
I
max
0.7
3
3.5
10
3
1.5
0.15
2.2
0.4
A
N
0.003
% V
O
dB
4
RR
66
65
80
3
S
0.3
1.0
%/1.0 k
Hrs.
Thermal Resistance JunctiontoCase, T Package
1. T
to T
= 0
°
to +125
°
C, for LM317T, D2T. T
low
to T
high
= 40
°
to +125
°
C, for LM317BT, BD2T, T
low
to T
high
= 55
°
to +150
°
C, for
NCV317BT, BD2T.
2. I
= 1.5 A, P
= 20 W
3. Load and line regulation are specified at constant junction temperature. Changes in V
O
due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
4. Power dissipation within an IC voltage regulator produces a temperature gradient on the die, affecting individual IC components on the die.
These effects can be minimized by proper integrated circuit design and layout techniques. Thermal Regulation is the effect of these
temperature gradients on the output voltage and is expressed in percentage of output change per watt of power change in a specified time.
5. C
Adj
, when used, is connected between the adjustment pin and ground.
6. Since LongTerm Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average
stability from lot to lot.
R
JC
5.0
°
C/W