參數(shù)資料
型號: NCV4276
廠商: ON SEMICONDUCTOR
英文描述: 400 mA Low-Drop Voltage Regulator(400mA低壓降穩(wěn)壓器)
中文描述: 400毫安低壓降穩(wěn)壓器(400mA的低壓降穩(wěn)壓器)
文件頁數(shù): 3/23頁
文件大小: 199K
代理商: NCV4276
NCV4276, NCV4276A
http://onsemi.com
3
PIN FUNCTION DESCRIPTION
Pin No.
Symbol
Description
1
I
Input; Battery Supply Input Voltage.
2
INH
Inhibit; Set low
to inhibit.
3
GND
Ground; Pin 3 internally connected to heatsink.
4
NC / VA
Not connected for fixed voltage version / Voltage Adjust Input for adjustable voltage version; use an external
voltage divider to set the output voltage
5
Q
Use 22 F, ESR < 2.5 at 10 kHz to ground with the 5.0 V and adjustable regulators. See Figures 3, 4, and 5.
Use 10 F, ESR < 1.8 at 10 kHz to ground with the 3.3 V, 2.5 V, and 1.8 V regulators. See Figures 3 and 6.
MAXIMUM RATINGS
*
Rating
Symbol
Min
Max
Unit
Input Voltage
V
I
42
45
V
Input Peak Transient Voltage
V
I
45
V
Inhibit INH Voltage
V
INH
42
45
V
Output Voltage
V
Q
1.0
40
V
Ground Current
I
q
100
mA
Input Voltage Operating Range
V
I
V
Q
+ 0.5 V or 4.5 V
(Note 1)
40
V
ESD Susceptibility
(Human Body Model)
(Machine Model)
(Charged Device Model)
4.5
250
1.25
kV
V
kV
Junction Temperature
T
J
40
150
°
C
Storage Temperature
T
stg
50
150
°
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*During the voltage range which exceeds the maximum tested voltage of I, operation is assured, but not specified. Wider limits may apply. Thermal
dissipation must be observed closely.
LEAD TEMPERATURE SOLDERING REFLOW
(Note 2)
Lead Temperature Soldering
Reflow (SMD styles only), Leaded, 60
150 s above 183, 30 s max at peak
Reflow (SMD styles only), Lead Free, 60
150 s above 217, 40 s max at peak
Wave Solder (through hole styles only), 12 sec max
T
SLD
240
265
310
°
C
THERMAL CHARACTERISTICS
Characteristic
Test Conditions (Typical Value)
Unit
DPAK 5
PIN PACKAGE
Min Pad Board
(Note 3)
1 Pad Board
(Note 4)
Junction
to
Tab (psi
JLx,
JLx
)
4.2
4.7
C/W
Junction
to
Ambient (R
JA
,
JA
)
D
2
PAK 5
PIN PACKAGE
100.9
46.8
C/W
0.4 sq. in. Spreader Board
(Note 5)
1.2 sq. in. Spreader Board
(Note 6)
Junction
to
Tab (psi
JLx,
JLx
)
3.8
4.0
C/W
Junction
to
Ambient (R
JA
,
JA
)
1. Minimum V
I
= 4.5 V or (V
Q
+ 0.5 V), whichever is higher.
2. Per
IPC / JEDEC J
STD
020C.
3. 1 oz. copper, 0.26 inch
2
(168 mm
2
) copper area, 0.062
thick FR4.
4. 1 oz. copper, 1.14 inch
2
(736 mm
2
) copper area, 0.062
thick FR4.
5. 1 oz. copper, 0.373 inch
2
(241 mm
2
) copper area, 0.062
thick FR4.
6. 1 oz. copper, 1.222 inch
2
(788 mm
2
) copper area, 0.062
thick FR4.
74.8
41.6
C/W
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