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NKS3 Series
Miniature Quartz Crystal
Ceramic SMD
DS-211 Rev A | 11/16/2005
Pericom Semiconductor Corporation 1-800-435-2336 http://www.pericom.com/saronix
All specifications are subject to change without notice.
Product Description
The 4-pad NKS3 Series devices incorporate a
sub-miniature AT-cut crystal resonator housed in
a standard 3.2x2.5mm ceramic package. These
compact crystals are ideal for surface mounting
in densely populated or small form-factor PCB
applications.
Product Features
Rugged AT-cut crystal construction
Miniature 3.2x2.5mm ceramic package
Available on tape & reel; 16mm tape, 1000/reel
Pb-free and Green/ROHS compliant
Typical Applications
Disc Drives
PCMCIA Cards
Portable / hand-held PCs
Notebook PC
GPS
Bluetooth
Wireless LAN
Common Frequencies (MHz):
14.3181
28.6363
15.3600
31.2500
16.0000
32.0000
16.3840
32.7680
19.2000
33.0000
20.0000
37.5000
20.4800
39.0625
22.1184
40.0000
24.0000
48.0000
24.5760
53.1250
25.0000
54.0000
26.0000
27.0000
Frequency Range:
14.3181 MHz to 54.0000 MHz (Fundamental)
Temperature Range:
Operating: –20 to +70°C or –40 to +85°C (as specified)
Storage: –40 to +85°C
Temperature Stability (as specified):
±10, ±20, ±30, ±50ppm (–20 to +70°C)
±30, ±50ppm (–40 to +85°C)
Characteristics at 25°C ±2°C:
Frequency Calibration Tolerance: ±10ppm, ±20ppm, ±30ppm
Load Capacitance: 14 to 20pF
Effective Series Resistance:
80 max (14 to 19.9 MHz)
60 max (20 to 29.9 MHz)
40 max (30 to 54 MHz)
Drive Level: 10W typ. (100W max)
Shunt Capacitance: 5pF Max.
Aging at 25°C, First Year:
±3ppm Typ., ±5ppm Max.
Mechanical:
Shock: MIL-STD-883, Method 2002 (Condition B)
Solderability: JESD22-B102-D Method 2 (Preconditioning E)
Vibration: MIL-STD-883, Method 2007 (Condition A)
Solvent Resistance: MIL-STD-202, Method 215
Resistance to Soldering Heat: J-STD-020C Table 5-2 Pb-free
devices (2 cycles max)
Environmental:
Gross Test Leak: MIL-STD-883, Method 1014 (Condition C)
Fine Test Leak: MIL-STD-883, Method 1014 (Condition A2)
Thermal Shock: MIL-STD-883, Method 1011 (Condition A)
Moisture Resistance: MIL-STD-883, Method 1004
Reflow Temperature:
260°C Max
Actual Size