NL17SZ07
http://onsemi.com
8
PACKAGE DIMENSIONS
SOT953
CASE 527AE
ISSUE E
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
D
C
A
HE
12 3
4
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
DIM
MIN
NOM
MAX
MILLIMETERS
A
0.34
0.37
0.40
b
0.10
0.15
0.20
C
0.07
0.12
0.17
D
0.95
1.00
1.05
E
0.75
0.80
0.85
e
0.35 BSC
L
0.95
1.00
1.05
HE
X
Y
PIN ONE
INDICATOR
b
5X
X
0.08
Y
L
5X
L3
L2
e
5X
L2
0.05
0.10
0.15
L3
0.15
0.175 REF
TOP VIEW
SIDE VIEW
BOTTOM VIEW
1.20
DIMENSIONS: MILLIMETERS
0.20
5X
1
PACKAGE
OUTLINE
0.35
PITCH
0.35
5X
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