參數(shù)資料
型號: NL17SZ125DTT1G
廠商: ON Semiconductor
文件頁數(shù): 2/12頁
文件大?。?/td> 0K
描述: IC BUFFER NONINV 3ST 5TSOP
標(biāo)準(zhǔn)包裝: 3,000
系列: 17SZ
邏輯類型: 緩沖器/線路驅(qū)動器,非反相
元件數(shù): 1
每個元件的位元數(shù): 1
輸出電流高,低: 32mA,32mA
電源電壓: 1.65 V ~ 5.5 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-TSOP(0.059",1.50mm 寬)5 引線
供應(yīng)商設(shè)備封裝: 5-TSOP
包裝: 帶卷 (TR)
其它名稱: NL17SZ125DTT1G-ND
NL17SZ125DTT1GOSTR
NL17SZ125
http://onsemi.com
10
PACKAGE DIMENSIONS
TSOP5
CASE 48302
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
MIN
MAX
MILLIMETERS
A
3.00 BSC
B
1.50 BSC
C
0.90
1.10
D
0.25
0.50
G
0.95 BSC
H
0.01
0.10
J
0.10
0.26
K
0.20
0.60
L
1.25
1.55
M
0
10
S
2.50
3.00
12
3
54
S
A
G
L
B
D
H
C
J
__
0.7
0.028
1.0
0.039
mm
inches
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
C AB
T
0.10
2X
T
0.20
NOTE 5
T
SEATING
PLANE
0.05
K
M
DETAIL Z
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