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參數(shù)資料
型號: NL17SZU04DFT2G
廠商: ON Semiconductor
文件頁數(shù): 2/7頁
文件大?。?/td> 0K
描述: IC INVERTER SGL UNBUFFER SOT353
產(chǎn)品變化通告: Wire Change for SC88/A 17/Jun/2011
標(biāo)準(zhǔn)包裝: 1
系列: 17SZU
邏輯類型: 反相器
電路數(shù): 1
輸入數(shù): 1
電源電壓: 1.65 V ~ 5.5 V
電流 - 靜態(tài)(最大值): 1µA
輸出電流高,低: 16mA,16mA
額定電壓和最大 CL 時的最大傳播延遲: 5ns @ 5V,50pF
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: SC-70
封裝/外殼: 6-TSSOP(5 引線),SC-88A,SOT-353
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: NL17SZU04DFT2GOSDKR
NL17SZU04
http://onsemi.com
2
PIN ASSIGNMENT
(SOT353/SC705/SC88A/SOT553)
Pin
1
2
3
4
5
Function
NC
A
GND
Y
VCC
Input
FUNCTION TABLE
Output
Y = A
Y
H
L
A
L
H
PIN ASSIGNMENT (SOT953)
Pin
1
2
3
4
5
Function
IN A
GND
NC
OUT Y
VCC
MAXIMUM RATINGS
Symbol
Parameter
Value
Units
VCC
DC Supply Voltage
0.5 to +7.0
V
VIN
DC Input Voltage
0.5 to +7.0
V
VOUT
DC Output Voltage (SOT353/SC705/SC88A/SOT553 Packages)
0.5 to VCC + 0.5
V
VOUT
DC Output Voltage
Output at High or Low State
(SOT953 Package)
PowerDown Mode (VCC = 0 V)
0.5 to VCC + 0.5
0.5 to + 0.5
V
IIK
DC Input Diode Current
50
mA
IOK
DC Output Diode Current
VOUT < GND, VOUT > VCC
(SOT353/SC705/SC88A/SOT553 Packages)
±50
mA
IOK
DC Output Diode Current (SOT953 Package)
VOUT < GND
50
mA
IOUT
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
TSTG
Storage Temperature Range
65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance
SC88A/SOT353 (Note 1)
SOT553
350
496
°C/W
PD
Power Dissipation in Still Air at 85°C
SC88A/SOT353
SOT553
186
135
mW
MSL
Moisture Sensitivity
Level 1
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
VESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Class IC
Class A
N/A
V
ILATCHUP
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
±100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow.
2. Tested to EIA/JESD22A114A, rated to EIA/JESD22A114B.
3. Tested to EIA/JESD22A115A, rated to EIA/JESD22A115A.
4. Tested to JESD22C101A.
5. Tested to EIA/JESD78.
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