NL27WZ07
http://onsemi.com
6
PACKAGE DIMENSIONS
TSOP6
CASE 318G02
ISSUE U
23
4
5
6
D
1
e
b
E1
A1
A
0.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
c
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN
NOM
MAX
MILLIMETERS
0.90
1.00
1.10
A1
0.01
0.06
0.10
b
0.25
0.38
0.50
c
0.10
0.18
0.26
D
2.90
3.00
3.10
E
2.50
2.75
3.00
e
0.85
0.95
1.05
L
0.20
0.40
0.60
0.25 BSC
L2
0
°
10°
1.30
1.50
1.70
E1
E
RECOMMENDED
NOTE 5
L
C
M
H
L2
SEATING
PLANE
GAUGE
PLANE
DETAIL Z
0.60
6X
3.20
0.95
6X
0.95
PITCH
DIMENSIONS: MILLIMETERS
M
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