參數(shù)資料
型號: NLX3G17BMX1TCG
廠商: ON Semiconductor
文件頁數(shù): 9/11頁
文件大小: 0K
描述: IC BUFFER TRPL SCHMT TRG 8ULLGA
標準包裝: 3,000
邏輯類型: 緩沖器/線路驅(qū)動器,非反相
元件數(shù): 3
每個元件的位元數(shù): 1
輸出電流高,低: 32mA,32mA
電源電壓: 1.65 V ~ 5.5 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-XFLGA
供應商設備封裝: 8-ULLGA(1.6x1)
包裝: 帶卷 (TR)
NLX3G17
http://onsemi.com
7
PACKAGE DIMENSIONS
UDFN8 1.45x1.0, 0.35P
CASE 517BZ
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM
MIN
MAX
MILLIMETERS
A
0.45
0.55
A1
0.00
0.05
A3
0.13 REF
b
0.15
0.25
D
1.45 BSC
E
1.00 BSC
e
0.35 BSC
L
0.25
0.35
L1
0.30
0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
0.05 C
C SEATING
PLANE
SIDE VIEW
2X
A3
BOTTOM VIEW
b
e
8X
L
7X
L1
1
4
5
8
e/2
DIMENSIONS: MILLIMETERS
0.22
7X
0.48
8X
1.18
0.53
PITCH
0.35
1
PKG
OUTLINE
0.10
B
0.05
A
C
C NOTE 3
M
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