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參數(shù)資料
| 型號(hào)： | NTP18N06L |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | JFETs |
| 英文描述： | Power MOSFET 15 Amps, 60 Volts, Logic Level (N−Channel TO−220 and DPAK) |
| 中文描述： | 15 A, 60 V, 0.1 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB |
| 封裝： | CASE 221A-09, 3 PIN |
| 文件頁(yè)數(shù)： | 7/12頁(yè) |
| 文件大小： | 92K |
| 代理商： | NTP18N06L |
NTP18N06L, NTB18N06L
http://onsemi.com
7
INFORMATION FOR USING THE D
2
PAK SURFACE MOUNT PACKAGE
RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to ensure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
mm
inches
0.33
8.38
0.04
1.016
0.63
17.02
0.42
10.66
0.12
3.05
0.24
6.096
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