參數(shù)資料
型號(hào): OP282GSZ
廠商: Analog Devices Inc
文件頁(yè)數(shù): 11/16頁(yè)
文件大?。?/td> 0K
描述: IC OPAMP JFET 4MHZ DUAL LP 8SOIC
標(biāo)準(zhǔn)包裝: 98
放大器類型: J-FET
電路數(shù): 2
轉(zhuǎn)換速率: 9 V/µs
增益帶寬積: 4MHz
電流 - 輸入偏壓: 3pA
電壓 - 輸入偏移: 200µV
電流 - 電源: 210µA
電流 - 輸出 / 通道: 12mA
電壓 - 電源,單路/雙路(±): 9 V ~ 36 V,±4.5 V ~ 18 V
工作溫度: -40°C ~ 90°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SO
包裝: 管件
產(chǎn)品目錄頁(yè)面: 774 (CN2011-ZH PDF)
OP282/OP482
Data Sheet
Rev. I | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage
±18 V
Input Voltage
±18 V
Differential Input Voltage1
36 V
Output Short-Circuit Duration
Indefinite
Storage Temperature Range
65°C to +150°C
Operating Temperature Range
40°C to +85°C
Junction Temperature Range
65°C to +150°C
Lead Temperature (Soldering 60 sec)
300°C
1
For supply voltages less than ±18 V, the absolute maximum input voltage is
equal to the supply voltage.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device in
socket for PDIP. θJA is specified for a device soldered in the circuit
board for SOIC_N, MSOP, and WLCSP packages. This was
measured using a standard 4-layer board.
Table 3.
Package Type
θJA
θJC
Unit
8-Lead MSOP [RM]
142
45
°C/W
8-Lead SOIC_N (S-Suffix) [R]
120
45
°C/W
14-Lead PDIP (P-Suffix) [N]
83
39
°C/W
14-Lead SOIC_N (S-Suffix) [R]
112
35
°C/W
14-Ball WLCSP [CB]1, 2
70
16
°C/W
1
Simulated thermal numbers per JESD51-9.
2
Junction-to-board thermal resistance.
ESD CAUTION
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