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參數(shù)資料
| 型號(hào)： | OP97FSZ-REEL7 |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 12/16頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP GP LP PREC 8SOIC |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 放大器類型： | 通用 |
| 電路數(shù)： | 1 |
| 轉(zhuǎn)換速率： | 0.2 V/µs |
| -3db帶寬： | 900kHz |
| 電流 - 輸入偏壓： | 30pA |
| 電壓 - 輸入偏移： | 30µV |
| 電流 - 電源： | 380µA |
| 電壓 - 電源，單路/雙路(±)： | ±2 V ~ 20 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SO |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | OP97FSZ-REEL7DKR |
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OP97
Rev. G | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply to both DICE and packaged
parts, unless otherwise noted.
Table 3.
Parameter
Rating
Supply Voltage
±20 V
Input Voltage1
±20 V
Differential Input Voltage2
±1 V
Differential Input Current2
±10 mA
Output Short-Circuit Duration
Indefinite
Operating Temperature Range
OP97E, OP97F (P, S)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature Range
65°C to +150°C
Lead Temperature (Soldering, 60 sec)
300°C
1 For supply voltages less than ±20 V, the absolute maximum input voltage is
equal to the supply voltage.
2 The inputs of the OP97 are protected by back-to-back diodes. Current-
limiting resistors are not used in order to achieve low noise. Differential
input voltages greater than 1 V cause excessive current to flow through the
input protection diodes unless limiting resistance is used.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4.
Package Type
θJA1
θJC
Unit
8-Lead PDIP (P Suffix)
103
43
°C/W
8-Lead SOIC (S Suffix)
158
43
°C/W
1 θJA is specified for worst-case mounting conditions, that is, θJA is specified for
device in socket for PDIP package; θJA is specified for device soldered to
printed circuit board for SOIC package.
ESD CAUTION
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