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參數(shù)資料
| 型號： | OPA354AQDBVRQ1 |
| 廠商： | Texas Instruments |
| 文件頁數(shù)： | 12/24頁 |
| 文件大小： | 0K |
| 描述： | IC OPAMP RRIO 250MHZ SOT23-5 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 放大器類型： | 電壓反饋 |
| 電路數(shù)： | 1 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 150 V/µs |
| 增益帶寬積： | 100MHz |
| -3db帶寬： | 250MHz |
| 電流 - 輸入偏壓： | 3pA |
| 電壓 - 輸入偏移： | 2000µV |
| 電流 - 電源： | 4.9mA |
| 電流 - 輸出 / 通道： | 100mA |
| 電壓 - 電源，單路/雙路(±)： | 2.5 V ~ 5.5 V，±1.25 V ~ 2.75 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | SC-74A，SOT-753 |
| 供應(yīng)商設(shè)備封裝： | SOT-23-5 |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 產(chǎn)品目錄頁面： | 854 (CN2011-ZH PDF) |
| 其它名稱： | 296-24618-6 |
1
2
3
5
4
V+
–In
+In
V–
Out
OPA354
DBV PACKAGE
(TOP VIEW)
OPA2354
DGK PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
+In A
–In A
Out A
V–
–In B
Out B
V+
+In B
OPA354-Q1
OPA2354-Q1
SBOS492A – JUNE 2009 – REVISED AUGUST 2009 ....................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TA
PACKAGE (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SOT-23 – DBV
Reel of 3000
OPA354AQDBVRQ1
OSFQ
–40°C to 125°C
MSOP – DGK
Reel of 2500
OPA2354AQDGKRQ1
OSLQ
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VS
Supply voltage, V+ to V–
7.5 V
VIN
Signal input terminals voltage
(V– – 0.5 V) to (V+ + 0.5 V)
Output short-circuit duration
Continuous
DBV package
150°C/W
θJA
Thermal impedance, junction to free air
DGK package
150°C/W
TOP
Operating temperature
–55°C to 150°C
TSTG
Storage temperature
–65°C to 150°C
TJ
Junction temperature
150°C
TLEAD
Lead temperature (soldering, 10 s)
300°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
UNIT
VS
Supply voltage, V– to V+
2.5
5.5
V
TA
Operating free-air temperature
–40
125
°C
2
Copyright 2009, Texas Instruments Incorporated
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