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Data Sheet
June 1999
ORCA Series 2 FPGAs
Lucent Technologies Inc.
145
Timing Characteristics (continued)
1. Readback of the configuration bit stream when simultaneously writing to a PFU in either SSPM fast mode or SDPM fast mode is not allowed.
2. Because the setup time of data into the latches/FFs is less than 0 ns, data written into the RAM can be loaded into a latch/FF in the same
PFU on the next opposite clock edge (one-half clock period).
Note: Speed grades of -5, -6, and -7 are for OR2TxxA devices only.
Table 39A. OR2CxxA and OR2TxxA Synchronous Memory Write Characteristics (SSPM and SDPM Modes)
OR2CxxA Commercial: VDD = 5.0 V ± 5%, 0 °C
≤ TA ≤ 70 °C; OR2CxxA Industrial: VDD = 5.0 V ± 10%, –40 °C TA ≤ +85 °C.
OR2TxxA Commercial: VDD = 3.0 V to 3.6 V, 0 °C
≤ TA ≤ 70 °C; OR2TxxA Industrial: VDD = 3.0 V to 3.6 V, –40 °C ≤ TA ≤
+85 °C.
Parameter
Symbol
Speed
Unit
-2
-3
-4
-5
-6
-7
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Write Operation for Fast-RAM Mode1:
Maximum Frequency
Clock Low Time
Clock High Time
Clock to Data Valid (CK to F[3:0])2
FFSCK
TFSCL
TFSCH
FMEMS_DEL
38.2
13.1
—
9.0
52.6
9.5
—
7.4
83.3
6.0
—
6.2
90.9
5.5
—
5.0
92.6
5.4
—
5.3
96.2
5.2
—
5.2
MHz
ns
Write Operation for Normal RAM Mode:
Maximum Frequency
Clock Low Time
Clock High Time
Clock to Data Valid (CK to F[3:0])
FSCK
TSCL
TSCH
MEMS_DEL
24.3
20.6
—
10.9
33.3
15.0
—
8.6
52.6
9.5
—
7.5
58.0
8.5
—
6.0
58.8
8.5
—
6.4
59.8
8.4
—
5.9
MHz
ns
Write Operation Setup Time:
Address to Clock (A[3:0]/B[3:0] to CK)
Data to Clock (WD[3:0] to CK)
Write Enable (WREN) to Clock
(A4 to CK)
Write-port Enable (WPE) to Clock
(C0 to CK)
MEMS_ASET
MEMS_DSET
MEMS_WRSET
MEMS_PWRSET
0.0
—
0.0
—
0.0
—
0.0
—
0.0
—
0.0
—
ns
Write Operation Hold Time:
Address to Clock (A[3:0]/B[3:0] to CK)
Data to Clock (WD[3:0] to CK)
Write Enable (WREN) to Clock
(A4 to CK)
Write-port Enable (WPE) to Clock
(C0 to CK)
MEMS_AHLD
MEMS_DHLD
MEMS_WRHLD
MEMS_PWRHLD
3.8
3.3
—
3.0
2.3
—
2.2
1.5
—
2.0
1.4
—
1.9
—
1.8
1.2
—
ns
Table 39.B OR2TxxB Synchronous Memory Write Characteristics (SSPM and SDPM Modes)
OR2TxxB Commercial: VDD = 3.0 V to 3.6 V, 0 °C
≤ TA ≤ 70 °C; OR2TxxB Industrial: VDD = 3.0 V to 3.6 V, –40 °C ≤ TA ≤ +85°C.
Parameter
Symbol
Speed
Unit
-7
-8
Min
Max
Min
Max
Write Operation for Fast-RAM Mode1:
Maximum Frequency
Clock Low Time
Clock High Time
Clock to Data Valid (CK to F[3:0])2
FFSCK
TFSCL
TFSCH
FMEMS_DEL
97.7
5.1
—
5.1
112.4
4.5
—
4.5
MHz
ns
Write Operation for Normal RAM Mode:
Maximum Frequency
Clock Low Time
Clock High Time
Clock to Data Valid (CK to F[3:0])
FSCK
TSCL
TSCH
MEMS_DEL
60.8
8.2
—
5.1
69.9
7.2
—
4.5
MHz
ns