參數(shù)資料
型號(hào)： OV7431
英文描述： MCU CMOS 18LD 4MHZ 1K EPRM, -40C to +85C, 18-PDIP, TUBE
中文描述： /黑白| NTSC制式| 508 × 492 |模擬|的CameraChip |技術(shù)報(bào)告
文件頁數(shù)： 8/16頁
文件大?。?/td> 289K
代理商： OV7431
8
Proprietary to OmniVision Technologies
Version 1.2, February 3, 2003
OmniVision Packaging Specifications
O
mni
ision
3 CameraChip Package Specification
3.1 24-Pin CLCC Ceramic Package Specification
Figure 3-1.
24-Pin CLCC Ceramic Package Specifications
+
Table 3-1.
24-Pin CLCC Ceramic Package Dimensions
Dimensions
Millimeters (mm)
Inches (in.)
Package Size
10.16 + 0.25 / -0.13 SQ
.400 +.01 / -.005 SQ
Package Height
2.24 + 0.28
.088 + .011
Substrate Height
0.51 + 0.05
.020 + .002
Cavity Size
6.99 + 0.15 SQ
.275 + .006 SQ
Castellation Height
1.14 + 0.13
.045 + .005
Pin #1 Pad Size
0.51 x 2.16
.020 x .085
Pad Size
0.51 x 1.02
.020 x .04
Pad Pitch
1.27 + 0.10
.050 + .004
Package Edge to First Lead Center
1.91 + 0.25
.075 + .01
End-to-End Pad Center-Center
6.35 + 0.13
.250 + .005
Glass Size
9.50 + 0.10 SQ
.374 + .004 SQ
Glass Height
0.55 + 0.05
.022 + .002
22
24
1
3
.050
TYP
.020 TYP
.250 TYP
21
16
10
15
.009 R REF
TYP
.012 R REF
.0TYP
4
9
.270
.320
± .008
4
9
15
10
.012 TYP
.022 TYP
7
18
6
1 24
19
3
1
24
22
.270 ± .006
.400 SQ- .005
21
16
.020 ± .002
.030 ± .003
.015 ± .002
.065 ± .007
.005 REF
.050 REF TYP
CERAMIC
KYOCERA A440
(BLACK)
MP-3
MP-1
MP-2
.006 R TYP
.006 R TYP
.005 x 45
o
PIN 1 INDEX
.085 REF
.075
± .010
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