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參數(shù)資料
| 型號(hào)： | OV7635 |
| 英文描述： | MCU CMOS 18LD 20MHZ 1K EPRM, 0C to +70C, 18-SOIC 300mil, TUBE |
| 中文描述： | 顏色|顯卡| 640 × 480 |數(shù)碼|的CameraChip |技術(shù)報(bào)告 |
| 文件頁(yè)數(shù)： | 11/16頁(yè) |
| 文件大小： | 289K |
| 代理商： | OV7635 |
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CameraChip Package Specification
Version 1.2, February 3, 2003
Proprietary to OmniVision Technologies
11
O
mni
ision
3.4 48-Pin CLCC Ceramic Package Specification
Figure 3-4.
48-Pin CLCC Ceramic Package Specifications
Table 3-4.
48-Pin CLCC Ceramic Package Dimensions
Dimensions
Millimeters (mm)
Inches (in.)
Package Size
14.22 + 0.30 / -0.13 SQ
.560 + .012 / - .005 SQ
Package Height
2.23 + 0.28
.088 + .011
Substrate Height
0.51 + 0.05
.020 + .002
Cavity Size
8.89 + 0.13 SQ
.350 + .005 SQ
Castellation Height
1.14 + 0.13
.045 + .005
Pin #1 Pad Size
0.51 x 2.16
.020 x .085
Pad Size
0.51 x 1.02
.020 x .040
Pad Pitch
1.02 + 0.08
.040 + .003
Package Edge to First Lead Center
1.524 + 0.25 / -0.13
.06 + .010 / - .005
End-to-End Pad Center-Center
11.18 + 0.13
.440 + .005
Glass Size
12.40 + 0.10 SQ / 13.00 + 0.10 SQ
.488 + .004 SQ / .512 + .004 SQ
Glass Height
0.55 + 0.05
.022 + .002
.022 ± .004
.001 to .005
TYP
.030 ± .002
.015 ± .002
.065 ± .007
.088 ± .011
.020 ± .002
.06 + .010 / - .005
.085 TYP
R .0075
(48 PLCS)
R .0075
(4 CORNERS)
.040 TYP
.040 ± .003
31
1
19
30
31
42
.350 SQ ± .005
.430 SQ ± .005
30
42
.032 MIN
43
43
19
18
18
48
1
48
6
6
7
7
31
42
30
19
.440 ± .005
43
48
1
6
7
18
.560 SQ + .012 / - .005
Pin 1
Index
.020 TYP
.488
± .004
.012 TYP
REF
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