參數(shù)資料
型號(hào)： P0300SBRP
英文描述： MCU CMOS 44 LD 20MHZ 8K OTP, -40C to +125C, 44-PLCC, TUBE
中文描述： SIDAC的| 40V的五（公報(bào)）最大| 800mA的我（縣）|的DO - 214AA
文件頁數(shù)： 132/161頁
文件大小： 986K
代理商： P0300SBRP
Soldering Recommendations
SIDACtor
Data Book
5 - 16
Teccor Electronics
(972) 580-7777
$
Overview
When placing surface mount components, a good solder bond is critical because:
1. The solder provides a thermal path in which heat is dissipated from the
packaged silicon to the rest of the board.
2. A good bond is less subject to thermal fatiguing and results in improved component
reliability.
Reflow Soldering
The preferred technique for mounting the DO-214 package is to reflow-solder the
device onto a PCB - printed circuit board. (Figure 5-6).
Figure 5-6 Reflow Soldering Procedure
For reliable connections, the PCB should first be screen printed with a solder paste or
fluxed with a reliable solution that is easily removed such as Alpha 5003 diluted with
benzyl alcohol. If using a flux, the PCB should be allowed to dry to touch at room
temperature (or in a 70
°
C oven) prior to placing the components on the solder pads.
Relying on the adhesive nature of the solder paste or flux to prevent the devices from
moving prior to reflow, components should be placed with either a vacuum pencil or
automated pick and place machine.
With the components in place, the PCB should be heated to a point where the solder
on the pads begins to flow. This is typically done on a conveyor belt which first
transports the PCB through a pre-heating zone. The pre-heating zone is necessary in
order to reduce thermal shock and prevent damage to the devices being soldered, and
should be limited to a maximum temperature of 165
°
C for 10 seconds.
After pre-heating, the PCB goes to a vapor zone. The vapor zone is obtained by
heating an inactive fluid to its boiling point while using a vapor lock to regulate the
chamber temperature. This temperature is typically 215
°
C, but for temperatures in
1. Screen print solder paste
(or flux)
2. Place component
(allow flux to dry)
3. Reflow solder
相關(guān)PDF資料
PDF描述
P0300SCRP MCU CMOS 44 LD 20MHZ 8K OTP, -40C to +125C, 44-MQFP, TRAY
P0602ABRP SIDAC|40V V(BO) MAX|800MA I(S)|TO-220VAR
P0602AC SIDAC|40V V(BO) MAX|800MA I(S)|TO-220VAR
P0602ACRP SIDAC|40V V(BO) MAX|800MA I(S)|TO-220VAR
P0640EA SIDAC|77V V(BO) MAX|800MA I(S)|TO-92VAR
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