參數(shù)資料
型號(hào): P0404FC12C
英文描述: Direct ProTek Replacement:P0404FC12C
中文描述: 直接太克替代:P0404FC12C
文件頁數(shù): 4/5頁
文件大小: 118K
代理商: P0404FC12C
4
P0404FC3.3C*
thru
P0404FC36C*
05154.R2 11/02
* U.S. Patent No. Des. “D456,367 S”
www.protekdevices.com
PACKAGE OUTLINE & DIMENSIONS
TAPE & REEL ORDERING INFORMATION:
Surface mount product is taped and reeled in accordance with EIA-481.
Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., P0404FC05C-T75-1).
Paper Tape: 7 Inch Reels - 10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., P0404FC05C-T710-2).
A
B
C
E
F
G
H
I
0.56 NOM
0.86 NOM
1.0 ± 0.02
0.15 SQ
1.0 ± 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
0.406 NOM
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.039 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002
).
PACKAGE OUTLINE
Picture Not Available
TAPE & REEL ORIENTATION
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
Dual Die - 0404
06022 Rev 3 - 11/02
G
H
E
F
I
S
A
B
C
TOP
END
0404
MOUNTING PAD LAYOUT - Option 1
C
SOLDER PRINT
0.010” - 0.012” DIA.
A
H
D
I
SOLDER PADS
F
G
E
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
DIM Millimeters
Inches
PAD DIMENSIONS
NOTE:
Preferred:Using 0.1mm (0.004
)
stencil.
DIE
SOLDER
BUMP
SOLDER MASK
相關(guān)PDF資料
PDF描述
P0404FC15C Direct ProTek Replacement:P0404FC15C
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P0404FC36C Direct ProTek Replacement:P0404FC36C
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