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參數(shù)資料
| 型號： | P0406FC08C |
| 英文描述： | Direct ProTek Replacement:P0406FC08C |
| 中文描述： | 直接太克替代：P0406FC08C |
| 文件頁數(shù)： | 4/6頁 |
| 文件大?。?/td> | 117K |
| 代理商： | P0406FC08C |
4
www.protekdevices.com
05155.R4 3/05
P0406FC3.3C*
thru
P0406FC36C*
*U.S. Patent No. Des. “D456,367S”
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S
- Preheat
T
SMAX
T
SMIN
T
L
t 25°C to Peak
30-60 seconds
T
T
P
155°
140°
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50μm
±20μm
60 Seconds
270°C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-265°C
T
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
APPLICATION INFORMATION
相關PDF資料 |
PDF描述 |
|---|---|
| P0406FC12C | Direct ProTek Replacement:P0406FC12C |
| P0406FC15C | Direct ProTek Replacement:P0406FC15C |
| P0406FC24C | Direct ProTek Replacement:P0406FC24C |
| P0406FC36C | FLIP CHIP ARRAY |
| P0406FC | FLIP CHIP ARRAY |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| P0406FC12C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:250w flip chip tvs array |
| P0406FC15C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Direct ProTek Replacement:P0406FC15C |
| P0406FC24C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:250w flip chip tvs array |
| P0406FC3.3C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FLIP CHIP ARRAY |
| P0406FC3.3C_11 | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:250w flip chip tvs array |
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