參數(shù)資料
型號: P0406FC
廠商: Electronic Theatre Controls, Inc.
英文描述: FLIP CHIP ARRAY
中文描述: 倒裝芯片陣列
文件頁數(shù): 5/6頁
文件大?。?/td> 117K
代理商: P0406FC
5
www.protekdevices.com
05155.R4 3/05
P0406FC3.3C*
thru
P0406FC36C*
*U.S. Patent No. Des. “D456,367S”
PACKAGE OUTLINE & DIMENSIONS
A
B
C
E
F
G
H
I
0.56 NOM
0.86 NOM
0.99 ± 0.0254
0.15 SQ
1.5 ± 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
0.406 NOM
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.059 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
PACKAGE OUTLINE
MOUNTING PAD LAYOUT - Option 1
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
NOTE:
1. Preferred:Using 0.1mm (0.004”) stencil.
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
PAD DIMENSIONS
DIM
MILLIMETERS
INCHES
Outline & Dimensions: Rev 3 - 11/02, 06023
G
H
E
F
I
S
A
B
C
TOP
END
C
SOLDER PRINT
0.010” - 0.012” DIA.
A
H
D
I
SOLDER PADS
F
G
E
SOLDER MASK
DIE
SOLDER
BUMPS
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