參數(shù)資料
型號： P0641SCRP
英文描述： 18LD 4MHZ 2K EPRM/128 EEPROM, -40C to +85C, 18-PDIP, TUBE
中文描述： SIDAC的| 77V V（下公報）最大| 800mA的我（縣）|的DO - 214AA
文件頁數(shù)： 130/161頁
文件大小： 986K
代理商： P0641SCRP
PCB Layout
SIDACtor
Data Book
5 - 14
Teccor Electronics
(972) 580-7777
The minimum width and thickness of conductors on a PCB is determined primarily by
the current-carrying capacity required. This current carrying capacity is limited by the
allowable temperature rise of the etched copper conductor. An adjacent ground or
power layer can significantly reduce this temperature rise. A single ground plane can
generally raise the allowed current by 50 percent. An easy approximation can be
generated by starting with Figure 5-4 to calculate the conductor cross sectional area
required. Once this has been done, Figure 5-5 converts the cross sectional area to the
required conductor width dependent on the copper foil thickness of the trace.
Figure 5-5 Conductor Width vs. Area
Trace Separation
Because Tip and Ring traces are subjected to transient conditions, they should be
routed towards the edge of the PCB away from sensitive areas, and should maintain a
minimum separation of 2.5mm between themselves and other traces. A good rule of
thumb for separation of non-coated top layer traces is to maintain spacing equal to
.010mm per volt.
Grounding
Although often overlooked, grounding is a very important design consideration when
laying out a protection interface circuit. To optimize its effectiveness, several things
should be considered.
The first is that a large copper plane should be provided using a grid pattern for the
ground reference point.
Next, it should be decided if a single point or a multi point grounding scheme is to be
used. A single-point (also called centralized) grounding scheme is used for circuit
dimensions smaller than one-tenth of a wavelength (
λ
= 300,000/F
kHz
) and a multi
point (also called distributed) grounding scheme is used for circuit trace lengths
0
.350
.300
.250
.030
.050
.070
.100
.150
.200
.010
.020
.005
.001
0
1
10
20
100 150
300
400
500
600
700
Conductor Cross-Section Area (sq mils)
5
30 50 70
200
250
C
0
"
7
0
0
0
2
t
o
2
"
4
1
0
0
2
t
o
1
(2oz/ft2 .0028"
(3oz/ft2) .0042"
相關(guān)PDF資料
PDF描述
P0720EA 18LD 4MHZ 2K EPRM/128 EEPROM, 0C to +70C, 18-SOIC 300mil, T/R
P0720EARP1 20LD 4MHZ 2K EPRM/128 EEPROM, -40C to +85C, 20-SSOP 208mil, T/R
P0720EARP2 18LD 20MHZ 2K EPRM/128 EEPROM, -40C to +85C, 18-SOIC 300mil, T/R
P0720EB MCU CMOS 18LD 2K EPRM/128 EEPROM, 0C to +70C, 18-PDIP, TUBE
P0720EBRP1 MCU CMOS 18LD 2K EPRM/128 EEPROM, -40C to +85C, 18-PDIP, TUBE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
P0641U 制造商:TECCOR 制造商全稱:TECCOR 功能描述:solid state crowbar devices
P0641U_L 制造商:LITTELFUSE 制造商全稱:Littelfuse 功能描述:Multiport SLIC Protector
P0641UAL 制造商:LITTELFUSE 制造商全稱:Littelfuse 功能描述:Multiport SLIC Protector
P0641UALRP 功能描述:硅對稱二端開關(guān)元件 50A 58V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
P0641UALTP 功能描述:硅對稱二端開關(guān)元件 50A 58V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
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