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參數(shù)資料
| 型號： | P1172.132T |
| 英文描述： | 20 Pin, 7.1 KB Std Flash, 256 RAM, 18 I/O Pb Free, -40C to +85C, 20-SSOP 208mil, T/R |
| 中文描述： | 核心鼓表面貼裝電感器（屏蔽） - P1172系列 |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 60K |
| 代理商： | P1172.132T |
15
PC500.B (5/02)
US 858 674 8100
UK 44 1483 401 700
France 33 3 84 35 04 04
Singapore 65 287 8998
Taiwan 886 2 2698 0228
Hong Kong 852 2788 6588
http://www.pulseeng.com
SMT POWER INDUCTORS
Shielded Drum Core - P1172 Series
Low profile and suitable for compact surface
area mounting
Large permissible DC current
Low DC resistance
Mechanical
Schematic
Weight
. . . . . . . . 4.5 grams
Tape & Reel
. . . . . . 450/reel
Unless otherwise specified, all tolerances are ±0,25
Dimensions:
Inches
mm
Part
Number
Inductance
@Irated
(
μ
H) MIN
0.8
1.3
1.8
2.4
3.1
3.9
4.9
7.5
9.0
11.3
13.5
16.5
20.3
24.8
29.3
35.3
51.0
Irated
1
(A
DC
)
DCR (m
)
Inductance
@0A
DC
(
μ
H)
1.3±30%
2.0±30%
2.7±30%
3.7±30%
4.7±30%
6.0±30%
7.6±30%
10±20%
12±20%
15±20%
18±20%
22±20%
27±20%
33±20%
39±20%
47±20%
68±20%
Saturation
Current
@25°C (A)
15
13
11
9.2
8.2
6.9
6.2
5.5
5.1
4.4
4.3
3.8
3.4
3.0
2.8
2.6
2.1
2
Heating
Current
(A)
14
10
9.0
8.3
7.9
6.0
5.7
5.2
4.5
4.1
4.0
3.8
3.6
3.1
2.7
2.6
2.1
3
Core Loss
4
Factor K
TYP
2.3
4.5
5.8
6.8
7.6
13.0
14.3
17.3
23.3
28.3
29.4
33.2
36.2
49.3
65.2
71.4
108.0
MAX
3.0
6.0
7.3
8.5
9.5
16.5
18.5
21.8
29.0
35.4
37.0
42.0
45.9
64.8
81.5
89.0
135.0
P1172.132T
P1172.202T
P1172.272T
P1172.372T
P1172.472T
P1172.602T
P1172.762T
P1172.103T
P1172.123T
P1172.153T
P1172.183T
P1172.223T
P1172.273T
P1172.333T
P1172.393T
P1172.473T
P1172.683T
14
10
9.0
8.3
7.9
6.0
5.7
5.2
4.5
4.1
4.0
3.8
3.4
3.0
2.7
2.6
2.1
89.8
113.0
129.1
153.4
171.9
196.3
225.0
248.7
276.3
300.8
339.1
369.7
409.4
455.9
494.8
551.3
671.0
Notes from Table
1. The rated current as listed is either the saturation current
or the heating current depending on which value is lower.
2. The saturation current is the current which causes the
inductance to drop to 65% (or 75%) of its nominal induc-
tance at zero bias. This current is determined by placing
the component at room ambient (25°C), and applying a
short duration pulse current (to eliminate self-heating
effects) to the component.
3. The heating current is the dc current, which causes the
temperature of the part to increase by not more than 40°C.
This current is determined by extending the terminals of the
component with 30mm length 28 gauge buss wires and
applying the current to the device for 30 minutes. The tem-
perature is measured by placing the thermocouple between
the winding and the shield.
4. In high volt*time applications, additional heating in the
component can occur due to core losses in the inductor
which may necessitate derating the current in order to limit
the temperature rise of the component. In order to deter-
mine the approximate total loss (or temperature rise) for a
given application, both copper losses and core losses
should be taken into account.
Estimated Temperature Rise:
Trise = [Total loss (mW) / 6.288]
.833
(
o
C )
Total loss = Copper loss + Core loss (mW)
Copper loss = Irms
2
x DCR (Typical) (mW)
Irms = [I
DC
2
+
I
2
/12]
1/2
(A)
Core loss = 6.81 x 10
-7
x f (kHz)
1.1
x (K x
I)
2.15
(mW),
where f varies between 25 kHz and 300 kHZ, and B less
than 2000 Gauss.
Electrical Specifications @ 25°C — Operating Temperature -40°C to +85°C
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